Addressing opportunities and risks of Pb-free solder alloy alternatives

2009 European Microelectronics and Packaging Conference, EMPC 2009

Volumn , Issue , 2009, Pages

  Henshall, Gregory ^a   Healey, Robert ^b   Pandher, Ranjit S ^b   Sweatman, Keith ^c   Howell, Keith ^c   Coyle, Richard ^d   Sack, Thilo ^e   Snugovsky, Polina ^e   Tisdale, Stephen ^f,g   Hua, Fay ^f,g   O'Malley, Grace ^a  

^a HEWLETT PACKARD COMPANY   (United States)

^b Cookson Electronics ^*  (United States)

^c Nihon Superior Co Ltd   (Japan)

^d NOKIA RESEARCH CENTER   (United States)

^e Celestica Inc   (Canada)

^f INTEL CORPORATION   (United States)

^g iNEMI ^*

Author keywords

Lead free; Low silver alloys; Microalloying; Pb free solder alloy; Reliability

Indexed keywords

ALLOY COMPOSITIONS; COPPER DISSOLUTION; FIELD EXPERIENCE; INDUSTRY STANDARDS; LEAD FREE; LOW SILVER ALLOYS; MECHANICAL BEHAVIOR; MECHANICAL SHOCK; NEW ALLOYS; PB-FREE ALLOYS; PB-FREE SOLDER ALLOY; PB-FREE SOLDER ALLOYS; PROCESS PARAMETERS; SN-AG-CU; SN-AG-CU ALLOY; THERMAL FATIGUE RESISTANCE; VOLUME MANUFACTURING;

ALLOYS; COPPER ALLOYS; DISSOLUTION; EUTECTICS; LEAD; METAL RECOVERY; MICROALLOYING; MICROELECTRONICS; RELIABILITY; SILVER; SOLDERING ALLOYS; SUPPLY CHAINS; TERNARY SYSTEMS; THERMAL FATIGUE; TIN; TIN ALLOYS;

SILVER ALLOYS;

EID: 70449954354     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (36)

1. Yoshiharu Kariya et al., J. of Elect. Mat, 33, No. 4, 2004.
2. C.M. Gourlay, J. Read, K. Nogita, and A.K. Dahle, "The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys", Journal of Electronic Materials, Special Issue Paper DOI: 10.1007/s11664-007-0248-8
3. K Sweatman, S. Suenaga and T. Nishimura, "Strength of Lead-free BGA Spheres in High Speed Loading" Proceedings Pan Pacific, 2008.
4. Ranjit S Pandher, Brian G Lewis, Raghasudha Vangaveti and Bawa Singh, "Drop Shock Reliability of Lead-Free Alloys - Effect of Micro-Additives," Proceedings 57th Electronic Components and Packaging Technology (ECTC), Reno, May 29-June 1, 2007.
5. Ranjit S Pandher, Robert Healey, "Reliability of Pb-Free Solder Alloys in Demanding BGA and CSP Applications," Proceedings 58th Electronic Components and Packaging Technology (ECTC), Orlando, May 27-30, 2008.
6. Werner Engelmaier "Surface Mount Solder Joint Long-Term Reliability: Design, Testing, Prediction," Soldering and Surface Mount Technology, vol 1, no. 1, 14-22, February, 1989.
7. J. Bartelo, et al., "Thermomechanical Fatigue Behavior of Selected Pb-Free Solders, Proceedings IPC APEX 2001, LF2-2, January 14-18, 2001.
8. N. Pan, et al., "An Acceleration Model for Sn-Ag-Cu Solder Joint Reliability Under Various Thermal cycle Conditions," Proceedings of SMTAI 2005, 876-883, Chicago, IL, September 2006.
9. J. Bath, et al., "Reliability Evaluations of Lead-Free SnAgCu PBGA676 Components Using Tin-Lead and Lead-Free SnAgCu Solder Paste," Proceedings of SMTAI, 891-901, Chicago, IL, September 25-29, 2005.
10. John Manock, et al., "Effect of Temperature Cycling Parameters on the Solder Joint Reliability of a Pb-free PBGA Package," Proceedings of SMTAI 2007, 564-573, Orlando, FL, October 2007.
11. B. Nandagopal, et al., "Study on Assembly, Rework Process, Microstructures and Mechanical Strength of Backward Compatible Assembly," Proceedings of SMTAI, 861-870, Chicago, IL, September 25-29, 2005.
12. H. McCormick et al. ,"The Great Debate: Comparing the Reliability of SAC305 and SAC405 Solders in a Variety of Applications," Proceedings Pan Pacific Symposium, January 31, 2007.
13. Unpublished results, Peter Borgeson, Unovis Consortium, November 2007.
14. S.K. Kang et al., "Evaluation of Thermal Fatigue Life and Failure Mechanisms of Sn-Ag-Cu Solder Joints with Reduced Ag Contents," Proceedings ECTC 2004, June , 2007.
15. S. Terashima et al., "Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip-Chip Interconnects," J. Electronic Materials, Vol 32, no. 12, 2003.
16. J. Liang, N. Dariavich, and D. Shangguan, "Solidification Condition Effects on Microstructure and Creep Resistance of Sn-3.8Ag-0.7Cu Lead-Free Solder," Metallurgical and Materials Transactions A, Vol. 38A, 1530-1538, July 2007.
17. C. Shea, et al., "Low-Silver BGA Assembly Phase I - Reflow Considerations and Joint Homogeneity Initial Report," Proceedings IPC APEX, April 2008.
18. C. Shea, et al., "Low-Silver BGA Assembly Phase I - Reflow Considerations and Joint Homogeneity Second Report: SAC105 Spheres with Tin-Lead Paste," Proceedings SMTAI, August 2008.
19. H. Kim, et al., "Improved Drop Reliability Performance with Lead Free Solders of Low Ag Content and Their Failure Modes," Proceedings ECTC, p. 962, 2007.
20. A. Syed, et al., "Effect of Pb free Alloy Composition on Drop/Impact Reliability of 0.4, 0.5 & 0.8mm Pitch Chip Scale Packages with NiAu Pad Finish," Proceedings ECTC p. 951, 2007.
21. D. Kim, et al., "Evaluation of High Compliant Low Ag Solder Alloys on OSP as a Drop Solution for the 2nd Level Pb-Free Interconnection," Proceedings ECTC p. 1614, 2007.
22. G. Henshall, et al., "Manufacturability and Reliability Impacts of Pb-Free BGA Ball Alloys," Unpublished research, Hewlett-Packard, 2007.
23. A. Syed, T. Kim, S Cha, "Alternate Solder Balls for Improving Drop/Shock Reliability," Proceedings SMTAI, p. 390, 2007.
24. Tanaka et al., Proceedings ECTC, p. 78 2006.
25. Y-S Lai et al., Microelectronics Reliability, 46, p. 645-650, 2006.
26. P. Snugovsky, et al., "Microstructure, Defects, and Reliability of Mixed Pb Free / SnPb Assemblies," Proceedings TMS, V 1: Materials Processing and Properties p.p. 631- 642, 2008.
27. B. Smith, P. Snugovsky, M. Brizoux, A. Grivon., "Industrial Backward Solution for Lead Free Exempted AHP Electronic Products: Process Technology Fundamentals and Failure Analysis," Proceedings IPC APEX, April 2008.
28. H. Holder, et al., "Test Data Requirements for Assessment of Alternative Pb-Free Solder Alloys" Proceedings SMTAI, p. 109, 2008.
29. S. Athavale, MS Dissertation, SUNY Binghamton, 2005.
30. K. Nogita & T. Nishimura, Scripta Materialia 59, 2 (2008) 191-194.
31. R. Darveaux and C. Reichman, "Mechanical Properties of Lead-Free Solders," Proceedings ECTC,. 695, 2007. p
32. R. Kinyanjui, et al., "Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process," proceedings APEX, 2008.
33. G. Henshall et al, "iNEMI Pb-Free Alloy Alternatives Project Report: State of the Industry", Proceedings SMTA International 2008, Orlando, Florida, August 2008
34. G. Henshall et al., "Addressing Industry Knowledge Gaps Regarding New Pb-Free Solder Alloy Alternatives" Proceedings of 33rd International Electronics Manufacturing Technology Conference 2008
35. G. Henshall et al., "Comparison of Thermal Fatigue Performance of SAC105 (Sn-1.0Ag-0.5Cu), Sn-3.5Ag, and SAC305 (Sn-3.0Ag-0.5Cu) BGA Components with SAC305 Solder Paste," Proceedings APEX, p. S05-03, 2009
36. L. G. Pymento, et al., "Lead Free Process Development with Thick Multipayer PCBA Density in Server Applications," Proceedings APEX, p. S05-02, 2009