The superior drop test performance of SAC-Ti solders and its mechanism

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2008, Pages

  Liu, Weiping ^a   Bachorik, Paul ^a   Lee, Ning Cheng ^a  

^a INDIUM CORPORATION   (United States)

Author keywords

Drop test; Fragility; Lead free; SAC; Solder; Tin silver copper

Indexed keywords

63SN37PB; CREEP PROPERTIES; DROP TEST; DROP-TEST PERFORMANCE; GRAIN SIZE; IMC LAYER; LEAD-FREE; MELTING TEMPERATURES; SAC ALLOY; SAC-SOLDERS; SURFACE FINISHES; TI ALLOYS; TIN-SILVER-COPPER;

ALLOYS; CERIUM ALLOYS; DROPS; LEAD; MANGANESE; MANGANESE COMPOUNDS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TESTING; TIN; TITANIUM COMPOUNDS;

TITANIUM ALLOYS;

EID: 77955107419     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2008.5507779     Document Type: Conference Paper

References (10)

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10. C. Robert Kao, "Cross-interaction between Cu and Ni in lead-free solder joints", TMS Lead Free Workshop, San Antonia, TX, March 12, 2006.