Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders

Soldering and Surface Mount Technology

Volumn 14, Issue 3, 2002, Pages

  Lee, Shi Wei Ricky ^a   Lui, Ben Hoi Wai ^a   Kong, Y H ^b   Baylon, Bernard ^b   Leung, Timothy ^b   Umali, Pompeo ^b   Agtarap, Hector ^b  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b Adv Interconnect Technology Ltd   (Hong Kong)

Author keywords

Ball grid array; Lead free; Reliability; Solder Joints

Indexed keywords

ASSEMBLY; FATIGUE OF MATERIALS; LEAD; LOADS (FORCES); RELIABILITY; SOLDERED JOINTS; SOLDERING ALLOYS; THERMAL LOAD;

LEAD-FREE SOLDERS;

ELECTRONICS PACKAGING;

EID: 18644362229     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910210444728     Document Type: Conference Paper

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