Influence of Bi on microstructures evolution and mechanical properties in Sn-Ag-Cu lead-free solder

Journal of Alloys and Compounds

Volumn 375, Issue 1-2, 2004, Pages 196-201

  Zhao, Jie ^a   Qi, Lin ^a   Wang, Xiu Min ^a   Wang, Lai ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Alloys; Mechanical properties; Microstructure; Precipitation

Indexed keywords

ALCOHOLS; ALUMINA; BISMUTH; ELECTRONICS PACKAGING; INTERMETALLICS; JOINTS (STRUCTURAL COMPONENTS); MICROSTRUCTURE; PRECIPITATION (CHEMICAL); RELIABILITY; SHEAR STRENGTH; SILVER; TIN; X RAY ANALYSIS;

LEAD-FREE SOLDERS; MICROSTRUCTURES EVOLUTION;

SOLDERING ALLOYS;

EID: 2942630857     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2003.12.005     Document Type: Article

References (13)

1. Jin S. JOM. 7:1993;13.
2. Zhao J., Mutoh Y., Miyashita Y., Mannan S.L. J. Electron. Mater. 31:2002;879.
3. Mutoh Y., Zhao J., Miyashita Y., Kanchanomai C. Sold. Surf. Mount Technol. 14:2002;37.
4. Lampe B.T. Weld. J. Res. Suppl. 55:1976;330s.
5. M.A. Whitemore, P.G. Harris, K.S. Chaggar, A.C. Hilton, Presented at NEPCON Europe, Middlesex, UK, 1990.
6. Choi W.K., Lee H.M. J. Electron. Mater. 29:2000;1207.
7. Chen C., Ho C.E., Lin A.H., Luo G.L., Kao C.R. J. Electron. Mater. 29:2000;1200.
8. Miao H.W., Duh J.G. Mater. Chem. Phys. 71:2001;255.
9. Frear D.R. JOM. 48:1996;49.
10. Vianco P.T., Rejent J.A. J. Electron. Mater. 28:1999;1138.
11. Kariya Y., Otsuka M. J. Electron. Mater. 27:1998;866.
12. Jin J., Joo D.K., Shin S.W. Acta Mater. 50:2002;4315.
13. Glazer J. Int. Mater. Rev. 40:1995;65.