Interfacial properties of Zn-Sn alloys as high temperature lead-free solder on Cu substrate

Materials Transactions

Volumn 46, Issue 11, 2005, Pages 2413-2418

  Lee, Jae Ean ^a   Kim, Keun Soo ^a   Suganuma, Katsuaki ^a   Takenaka, Junichi ^b   Hagio, Koichi ^b  

^a OSAKA UNIVERSITY   (Japan)

^b Technical Dep   (Japan)

Author keywords

High temperature solder; Interfacial microstructure; Intermetallic compound; Joining strength; Lead free solder; Zinc tin alloy

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY; INTERMETALLICS; MICROSTRUCTURE; SOLDERING ALLOYS; SUBSTRATES; SURFACE CHEMISTRY;

HIGH TEMPERATURE SOLDERS; JOINING STRENGTH; LEAD-FREE SOLDERS; ZINC-TIN ALLOY;

ZINC ALLOYS;

EID: 30844457513     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.46.2413     Document Type: Article

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