Thermal properties and phase stability of Zn-Sn and Zn-In alloys as high temperature lead-free solder

Materials Transactions

Volumn 48, Issue 3, 2007, Pages 584-593

  Lee, Jae Ean ^a   Kim, Keun Soo ^a   Suganuma, Katsuaki ^a   Inoue, Masahiro ^a   Izuta, Goro ^b  

^a OSAKA UNIVERSITY   (Japan)

^b MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

High temperature solder; Lead free solder; Thermal and humidity test; Zinc indium alloy; Zinc tin alloy

Indexed keywords

ATMOSPHERIC HUMIDITY; ELONGATION; MELTING POINT; OXIDATION; PHASE STABILITY; TENSILE STRENGTH; THERMAL EXPANSION;

HIGH TEMPERATURE SOLDERS; LEAD FREE SOLDERS; LIQUID FRACTION; THERMAL DEFORMATION;

ZINC ALLOYS;

EID: 34247340835     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.48.584     Document Type: Article

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