Microstructural characterization of Au/Sn solder for packaging in optoelectronic applications

Micron

Volumn 29, Issue 4, 1998, Pages 281-287

  Ivey, D G ^a  

^a UNIVERSITY OF ALBERTA   (Canada)

Author keywords

Au Sn; Coevaporation; Electron microscopy; InP; Solder

Indexed keywords

EID: 0032146217     PISSN: 09684328     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0968-4328(97)00057-7     Document Type: Conference Paper

References (10)

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7. Lee, C. H., Tai, K. L., Bacon, D. D., Doherty, C., Katz, A., Wong, Y. M. and Lane, E., 1994, Bonding of InP laser diodes by Au-Sn solder and tungsten-based barrier metallization schemes. Semicond. Sci. Technol., 9, 379-386.
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