Laser sintering of Ag nanopaste film and its application to bond-pad formation

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1745-1750

  Niizeki, Tomotake ^a   Maekawa, Katsuhiro ^b   Mita, Mamoru ^c   Yamasaki, Kazuhiko ^b   Matsuba, Yorishige ^d   Terada, Nobuto ^d   Saito, Hiroshi ^d  

^a JAPAN SCIENCE AND TECHNOLOGY AGENCY   (Japan)

^b IBARAKI UNIVERSITY   (Japan)

^c Mita Engineering Office   (Japan)

^d Harima Chemicals Inc   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER NETWORKS; COPPER; FURNACES; LASER HEATING; LASERS; NANOPARTICLES; NANOSTRUCTURES; NEODYMIUM LASERS; SPIN COATING; SUBSTRATES;

AG FILMS; LASER SINTERING; SINTERING;

SILVER;

EID: 51349165456     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550216     Document Type: Conference Paper

References (9)

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