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Volumn , Issue , 2008, Pages 291-295
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Wafer Backside Coating™ of electrically conductive die attach adhesives for packaging of discrete semiconductor devices
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVES;
CHIP SCALE PACKAGES;
COATINGS;
CONDUCTING POLYMERS;
DATA STORAGE EQUIPMENT;
DIES;
ELECTRIC CONDUCTIVITY;
ELECTRONIC EQUIPMENT MANUFACTURE;
FILLERS;
FILLING;
ORGANIC POLYMERS;
PRINTING;
PRINTING PROPERTIES;
RESINS;
SEMICONDUCTING SILICON COMPOUNDS;
SEMICONDUCTOR DEVICE MANUFACTURE;
SEMICONDUCTOR DEVICES;
SEMICONDUCTOR MATERIALS;
SILICON WAFERS;
SILVER;
TECHNOLOGICAL FORECASTING;
TECHNOLOGY;
THICKNESS MEASUREMENT;
COATED WAFERS;
COATING THICKNESS;
CONDUCTIVE PASTES;
COST SENSITIVES;
DEPOSITION EQUIPMENTS;
DIE ATTACH ADHESIVES;
DIE STACKING;
ECONOMIC ADVANTAGES;
ELECTRICALLY CONDUCTIVE;
ELEVATED TEMPERATURES;
FILLER TECHNOLOGIES;
HIGH STRENGTHS;
LEADFRAME;
MEMORY DEVICES;
NON CONTACTS;
NOVEL ADHESIVES;
PICK-UP;
RELIABILITY TESTS;
ROAD MAPS;
SEMICONDUCTOR ASSEMBLIES;
SILVER CONTENTS;
SINGULATED DIES;
SOLID FILMS;
STENCIL PRINTINGS;
EPOXY RESINS;
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EID: 63049101237
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/EPTC.2008.4763450 Document Type: Conference Paper |
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Times cited : (2)
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References (2)
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