SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 9, 2009, Pages 1906-1912

Study of solidification cracks in Sn-Ag-Cu lead-free solder joints

(5) Dong, Wenxing a Shi, Yaowu a Lei, Yongping a Xia, Zhidong a Guo, Fu a

a BEIJING UNIVERSITY OF TECHNOLOGY (China)

Author keywords

Lead free solder; Small elemental additions; Sn Ag Cu solder alloy; Solidification cracks

Indexed keywords

CRACK LENGTH; LEAD-FREE SOLDER; SMALL ELEMENTAL ADDITIONS; SN-3.0AG-0.5CU; SN-AG-CU ALLOY; SN-AG-CU LEAD-FREE SOLDERS; SN-AG-CU SOLDER ALLOY; SNAGCU SOLDER; SOLDER JOINTS; SOLIDIFICATION CRACKING; SOLIDIFICATION CRACKS; TRACE AMOUNTS;

ALLOYS; BRAZING; CERIUM; CERIUM COMPOUNDS; COPPER ALLOYS; CRACKS; CRYSTALLIZATION; LEAD; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; SOLIDIFICATION; TIN ALLOYS; WELDING;

TIN;

EID: 68949146613 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0839-7 Document Type: Article

Times cited : (12)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.