Fracture mechanics analysis of solder joint intermetallic compounds in shear test

Computational Materials Science

Volumn 45, Issue 2, 2009, Pages 576-583

  Alam, M O ^a   Lu, H ^a   Bailey, Chris ^a   Chan, Y C ^b  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

BGA; Butt joints; Electronic package; Intermetallic; Pb free; Plastic deformation; Solder; Stress intensity factor

Indexed keywords

ASPHALT PAVEMENTS; BRAZING; BRITTLE FRACTURE; BUTT WELDING; COMPUTER SIMULATION; CRACK TIPS; ELASTICITY; FRACTURE MECHANICS; LEAD; LEAD ALLOYS; NUMERICAL METHODS; PLASTIC DEFORMATION; PLASTICS; SEMICONDUCTING INTERMETALLICS; STRENGTH OF MATERIALS; STRESS INTENSITY FACTORS;

BGA; BUTT JOINTS; ELECTRONIC PACKAGE; PB-FREE; SOLDER; STRESS INTENSITY FACTOR;

SOLDERING ALLOYS;

EID: 62149105190     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.commatsci.2008.12.001     Document Type: Article

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