Formation of intermetallic compounds in SnAgBiIn solder systems on Cu substrates

Journal of Alloys and Compounds

Volumn 476, Issue 1-2, 2009, Pages 436-440

  Wu, Albert T ^a   Chen, Ming Hsun ^b   Huang, Che Hsun ^b  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

^b NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY   (Taiwan)

Author keywords

Intermetallic compounds; Kinetic analysis; Pb free solders; SnAgBiIn solder systems

Indexed keywords

BULK SOLDERS; CU SUBSTRATES; EPMA; INTERMETALLIC COMPOUNDS; KINETIC ANALYSIS; MECHANICAL STRENGTHS; PB-FREE SOLDERS; SN-PB SOLDERS; SNAGBIIN SOLDER SYSTEMS; THERMODYNAMIC EXPLANATIONS;

BRAZING; GROWTH KINETICS; LEAD; LEAD ALLOYS; LEAD COMPOUNDS; MELTING POINT; PHASE DIAGRAMS; PHASE INTERFACES; SEMICONDUCTING INTERMETALLICS; SOLID SOLUTIONS; STEELMAKING; THERMOCHEMISTRY; TIN; WELDING;

SOLDERING ALLOYS;

EID: 64549093818     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.09.001     Document Type: Article

References (29)

1. Kim H.K., and Tu K.N. Phys. Rev. B 53 (1996) 16027
2. Lee T.Y., Tu K.N., and Frear D.R. J. Appl. Phys. 90 (2001) 4502
3. Kim H.K., Liou H.K., and Tu K.N. Appl. Phys. Lett. 66 (1995) 2337
4. Wu A.T., and Hua F. J. Mater. Res. 22 (2007) 735
5. Sharif A., and Chen Y.C. Mater. Sci. Eng. B 106 (2004) 126
6. Vianco P.T., and Rejent J.A. J. Electron. Mater. 28 (1999) 1127
7. Li J.F., Mannan S.H., Clode M.P., Whalley D.C., and Hutt D.A. Acta Mater. 54 (2006) 2907
8. Hwang C.W., and Suganuma K. Mater. Sci. Eng. A 373 (2004) 187
9. Yoon eJ.-W., Lee C.-B., and Jung S.-B. J. Electron. Mater. 32 (2003) 1195
10. He M., and Acoff V.L. J. Electron. Mater. 35 (2006) 2098
11. Kariya Y., and Otsuka M. J. Electron. Mater. 27 (1998) 1229
12. Suganuma K. Curr. Opin. Solid State Mater. Sci. 5 (2001) 55
13. Yang Q.L., and Shang J.K. J. Electron. Mater. 34 (2005) 1363
14. Vianco P.T., Hlava P.F., and Kilgo A.C. J. Electron. Mater. 23 (1994) 583
15. Chuang T.H., Yu C.L., Chang S.Y., and Wang S.S. J. Electron. Mater. 31 (2004) 640
16. Sharif A., and Chan Y.C. J. Alloys Compd. 390 (2005) 67
17. Kim K.-S., Imanishi T., Suganuma K., Ueshima M., and Kato R. Microelectron. Reliab. 47 (2007) 1113
18. Yoon J.-W., Kim S.-W., and Jung S.-B. Mater. Trans. 45 (2004) 727
19. Shiue R.K., Tsai L.W., Lin C.L., and Ou J.L. J. Mater. Sci. 38 (2003) 1269
20. Kim M.-I., Moon J.-K., and Jung J.-P. Mater. Trans. 43 (2002) 1791
21. Vassilev G.P., Dobrev E.S., and Tedenac J.-C. J. Alloys Compd. 399 (2005) 118
22. Liu X.J., Inohana Y., Takaku Y., Ohnuma I., Kainuma R., Ishida K., Moser Z., Gasior W., and Pstrus J. J. Electron. Mater. 31 (2002) 1139
23. Korhonen T.M., and Kivilahti J.K. J. Electron. Mater. 27 (1998) 149
24. Ohnuma I., Cui Y., Liu X.J., Inohana Y., Ishihara S., Ohtani H., Kainuma R., and Ishida K. J. Electron. Mater. 29 (2000) 1113
25. Chen S.W., Wang C.H., Lin S.K., and Chiu C.N. J. Mater. Sci.: Mater. El 18 (2007) 19
26. Gusak A.M., and Tu K.N. Phys. Rev. B 66 (2002) 115403
27. Dariavach N., Callahan P., Liang J., and Fournelle R. J. Electron. Mater. 35 (2006) 1581
28. Huang M.L., and Wang L. Metall. Mater. Trans. A 36 (2005) 1439
29. Yeh M.S. Metall. Mater. Trans. A 34A (2003) 361