Interfacial reaction and shear strength of SnAgCu-xNi/Ni solder joints during aging at 150 °C

Microelectronic Engineering

Volumn 86, Issue 10, 2009, Pages 1969-1974

  Yao, Pei ^a,c   Liu, Ping ^a,b   Liu, Jim ^b  

^a TIANJIN UNIVERSITY   (China)

^b Motorola China Research Center   (China)

^c UNIVERSITY OF WOLLONGONG   (Australia)

Author keywords

(A)Composite materials; (A)Intermetallics (IM); (C)Microstructure; (C)Scanning electron microscopy (SEM)

Indexed keywords

(A)COMPOSITE MATERIALS; (A)INTERMETALLICS (IM); (C)MICROSTRUCTURE; (C)SCANNING ELECTRON MICROSCOPY (SEM); AGING PROCESS; AGING TIME; BULK SOLDER; COMPOSITE JOINT; COMPOSITE SOLDERS; COMPOSITIONAL ANALYSIS; IMC LAYER; INTERFACIAL CHARACTERISTICS; INTERFACIAL MICROSTRUCTURE; INTERFACIAL REACTIONS; INTERFACIAL STRUCTURES; INTERMETALLIC COMPOUNDS; JOINT RELIABILITY; LAYER THICKNESS; MICRO-PARTICLES; NI ADDITIONS; NON-COMPOSITE; SHEAR TESTING; SOLDER JOINTS; WEIGHT PERCENTAGES;

BRAZING; COMPOSITE MATERIALS; COMPOSITE MICROMECHANICS; MICROSTRUCTURE; SCANNING; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SOLDERING ALLOYS; TIN; WELDING;

NICKEL;

EID: 67649976756     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.12.013     Document Type: Article

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