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Journal of Alloys and Compounds

Volumn 509, Issue 34, 2011, Pages 8554-8560

Development of high strength Sn-0.7Cu solders with the addition of small amount of Ag and in

(2) El Daly, A A a Hammad, A E a

a Zagazig University (Egypt)

Author keywords

Intermetallic compounds; Lead free solder; Microstructure; Sn Cu alloy; Tensile properties

Indexed keywords

COMPREHENSIVE PROPERTIES; EFFECTS OF TEMPERATURE AND STRAIN RATE; GRAIN DIMENSION; HIGH STRENGTH; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; MECHANICAL PERFORMANCE; MICROSTRUCTURAL ANALYSIS; QUATERNARY ALLOYS; SN DENDRITES; SN-0.7CU SOLDER; SN-CU ALLOY; SOLDER ALLOYS; SOLDER JOINTS; SOLDER MATERIAL; TEMPERATURE DEPENDENCE; TENSILE TESTS; ULTIMATE TENSILE STRENGTH;

CERIUM ALLOYS; COPPER ALLOYS; EUTECTICS; HIGH STRENGTH ALLOYS; INTERMETALLICS; METALLIC COMPOUNDS; MICROSTRUCTURE; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; STRAIN RATE; TEMPERATURE; TENSILE STRENGTH; TENSILE TESTING; TIN ALLOYS; YIELD STRESS;

TIN;

EID: 79960457520 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2011.05.119 Document Type: Article

Times cited : (86)

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