Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (1 0 0) single crystal Cu

Scripta Materialia

Volumn 59, Issue 3, 2008, Pages 317-320

  Shang, P J ^a   Liu, Z Q ^a   Li, D X ^a   Shang, J K ^a,b  

^a INSTITUTE OF METAL RESEARCH   (China)

^b University of Illinois at Urbana Champaign   (United States)

Author keywords

Cu3Sn; Growth; Interface; Soldering; Transmission electron microscopy (TEM)

Indexed keywords

COPPER COMPOUNDS; EUTECTICS; INTERFACES (MATERIALS); SINGLE CRYSTALS; SOLDERING ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

CRYSTALLOGRAPHIC RELATIONSHIP; DIRECTIONAL GROWTH; INTERFACIAL REACTION; TRIPLE JUNCTION SITES;

CRYSTAL GROWTH;

EID: 44449105957     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2008.03.031     Document Type: Article

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