Creep behavior of lead-free Sn-Ag-Cu + Ni-ge solder alloys

Journal of Electronic Materials

Volumn 38, Issue 5, 2009, Pages 670-677

  Hidaka, N ^a   Watanabe, H ^a   Yoshiba, M ^b  

^a FUJI ELECTRIC CO   (Japan)

^b TOKYO METROPOLITAN UNIVERSITY   (Japan)

Author keywords

Creep; Microstructure; Sn Ag Cu Ni Ge lead free solders; TH

Indexed keywords

CREEP BEHAVIORS; CREEP DEFORMATIONS; CREEP RUPTURE LIVES; ELEVATED TEMPERATURES; INTERMETALLIC COMPOUNDS; LEAD-FREE; LEAD-FREE SOLDER ALLOYS; MICRO-STRUCTURAL CHARACTERIZATIONS; MICROSTRUCTURAL DEVELOPMENT; SN-3.0 AG-0.5CU; SN-AG-CU; SN-AG-CU-NI-GE LEAD-FREE SOLDERS; SOLDER ALLOYS; TH; THROUGH HOLES; TRANSMISSION ELECTRONS;

BRAZING; CERIUM ALLOYS; COPPER ALLOYS; CREEP; FLUXES; GERMANIUM; INTERMETALLICS; LEAD; MECHANICAL PROPERTIES; MICROSTRUCTURE; NICKEL; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY; WELDING;

TIN;

EID: 62549136517     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0689-3     Document Type: Article

References (25)

1. National Center for Manufacturing Sciences, "Lead-Free Solder Project Final Report," NCMS Report 0401RE96, August (1997)
2. Lead-Free Soldering Roadmap Committee of JEITA, "Lead-Free Roadmap 2002," official version2.1, September (2002)
3. M. Nagano, N. Hidaka, M. Shimoda, and H. Watanabe, Proceedings of New Frontiers of Process Science and Engineering in Advanced Materials (Japan: High Temperature Society of Japan, 2004), pp. 256-261.
4. T.T. Mattila J.K. Kivilahti 2005 J. Electron. Mater. 34 969
5. T.H. Chuang S.F. Yen M.D. Cheng 2006 J. Electron. Mater. 35 302
6. S. Terashima M. Tanaka 2004 Mater. Trans. 45 681
7. I. Shoji S. Tsunoda H. Watanabe T. Asai M. Nagano 2005 Mater. Trans. 46 2737
8. V.I. Igoshev J.I. Kleiman 2000 J. Electron. Mater. 29 244
9. C.M.L. Wu M.L. Huang 2002 J. Electron. Mater. 31 442
10. M. Kerr N. Chawla 2004 Acta Metall. 52 4527
11. R.J. Mccabe M.E. Fine 2002 Metall. Mater. Trans. 33A 1531
12. K. Atsumi, Y. Kariya, and M. Otsuka, Proceedings of 6th Symposium on Microjoining and Assembly Technology in Electronics (Japan: The Japan Welding Society, 2000), pp. 281-286
13. Y. Kariya M. Otsuka W.J. Plumbride 2003 J. Electron. Mater. 32 1398
14. I. Shohji, T. Yoshida, T. Takahashi, and S. Hioki, Proceedings of 9th Symposium on Microjoining and Assembly Technology in Electronics (Japan: The Japan Welding Society, 2003), pp. 229-234.
15. Z. Chen Y. Shi Z. Xia 2004 J. Electron. Mater. 33 964
16. F. Ochoa X. Deng N. Chawla 2004 J. Electron. Mater. 33 1596
17. P.T. Vianco J. Rejent A.C. Kilgo 2004 J. Electron. Mater. 33 1389
18. Q. Xiao W.D. Armstrong 2005 J. Electron. Mater. 34 196
19. D. Mitlin, C.H. Raeder, and R.W. Messler Jr., Metall. Mater. Trans. 30A, 115 (1999)
20. R. Ninomaya, Y. Nakahara, and T. Takemoto, Proceedings of 9th Symposium on Microjoining and Assembly Technology in Electronics (Japan: The Japan Welding Society, 1998), pp. 249-252.
21. M. Nagano N. Hidaka M. Shimoda M. Ono 2005 J. Jpn Inst. Electr. Packag. 8 495
22. M. Nagano N. Hidaka H. Watanabe M. Shimoda M. Ono 2006 J. Jpn Inst. Electr. Packag. 9 171
23. M. Shimoda, K. Matusmura, and T. Nakanisi, Proceedings of 9th Symposium on Microjoining and Assembly Technology in Electronics (Japan: The Japan Welding Society, 2003), pp. 325-330
24. N. Hidaka, H. Watanabe, M. Shimoda, M. Ono, and M. Nagano, Proceedings of 12th Symposium on Microjoining and Assembly Technology in Electronics (Japan: The Japan Welding Society, 2006), pp. 235-238.
25. N. Hidaka, M. Nagano, M. Shimoda, H. Watanabe, and M. Ono, Proceedings of ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (San Francisco, CA: ASME, InterPACK, 2005), p. 73148