Electronic and crystal structure and bonding in Ti-based ternary solid solution nitrides and Ti-Cu-N nanocomposite films

Surface and Coatings Technology

Volumn 205, Issue 5, 2010, Pages 1324-1330

  Patsalas, P ^a   Abadias, G ^b   Matenoglou, G M ^a   Koutsokeras, L E ^a,b   Lekka, Ch E ^a  

^a UNIVERSITY OF IOANNINA   (Greece)

^b UNIVERSITÉ DE POITIERS   (France)

Author keywords

Bonding; Physical vapor deposition; Structure; Ternary nitrides

Indexed keywords

ATOMIC STRUCTURE; BONDING MECHANISM; COMPLEX TRANSITIONS; DUAL ION BEAM SPUTTERING; INTER-BAND TRANSITION; IONIC CHARACTER; KINETIC EFFECT; NANOCOMPOSITE FILM; NANOCOMPOSITE NITRIDES; OPTICAL ABSORPTION BANDS; SEQUENTIAL DEPOSITION; SIMULTANEOUS DEPOSITION; STRUCTURE; TERNARY NITRIDES; TRANSITION METAL NITRIDES; VALENCE ELECTRON;

COPPER; CRYSTAL ATOMIC STRUCTURE; HAFNIUM; METALS; NANOCOMPOSITES; PULSED LASER DEPOSITION; SPUTTERING; TANTALUM; ZIRCONIUM;

TITANIUM NITRIDE;

EID: 78650032423     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2010.09.024     Document Type: Article

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