The role of hcp-AlN on hardness behavior of Ti1-xAlxN nanocomposite during annealing

Thin Solid Films

Volumn 469-470, Issue SPEC. ISS., 2004, Pages 339-344

  Santana, A Escudeiro ^a   Karimi, A ^a   Derflinger, V H ^b   Schutze A ^b  

^a EPFL   (Switzerland)

^b Balzers AG   (Liechtenstein)

Author keywords

Annealing; Hardness; Microstructure; Nanocomposite; Thermal stability; TiAlN

Indexed keywords

ALUMINUM NITRIDE; ANNEALING; DECOMPOSITION; DIFFUSION; GRAIN GROWTH; HARDNESS; INDENTATION; MICROSTRUCTURE; SOLID SOLUTIONS; STRESS RELAXATION; THERMODYNAMIC STABILITY; THIN FILMS; TITANIUM ALLOYS; TRANSMISSION ELECTRON MICROSCOPY; VACUUM; X RAY DIFFRACTION ANALYSIS;

MECHANICAL STABILITY; NANOINDENTATION; PHASE FORMATION; TIALN;

NANOSTRUCTURED MATERIALS;

EID: 10044228328     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.08.147     Document Type: Article

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