Compositional and structural evolution of sputtered Ti-Al-N

Thin Solid Films

Volumn 517, Issue 24, 2009, Pages 6635-6641

  Chen, Li ^a,b   Moser, Martin ^a   Du, Yong ^b   Mayrhofer, Paul H ^a  

^a UNIVERSITY OF LEOBEN   (Austria)

^b CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Composition; Physical vapour deposition (PVD); Reactive sputtering; Ti Al N

Indexed keywords

AL CONTENT; ANGULAR LOSS; APPLIED MAGNETIC FIELDS; COMPOSITION; COMPOSITIONAL AND STRUCTURAL EVOLUTION; COMPOSITIONAL VARIATION; DEPOSITION CONDITIONS; MAGNETRON POWER; METAL FLUXES; PHYSICAL VAPOUR DEPOSITION; SPUTTERING POWER; STRUCTURAL MODIFICATIONS; STRUCTURE DEVELOPMENT; TI-AL-N; TOTAL PRESSURE RATIO; WORKING GAS PRESSURE;

COATINGS; FILM PREPARATION; HARDENING; ION BOMBARDMENT; IONS; MAGNETIC FIELDS; REACTIVE SPUTTERING; SETTLING TANKS; TARGETS; THIN FILMS;

ALUMINUM;

EID: 71749121474     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.04.056     Document Type: Article

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