Mechanical properties and oxidation resistance of nanocomposite TiN-SiNx physical-vapor-deposited thin films

Surface and Coatings Technology

Volumn 120-121, Issue , 1999, Pages 158-165

  Diserens, M ^a,b   Patscheider, J ^a   Levy F ^b  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

^b EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

COATING; OXIDATION; RESISTANCE; TITANIUM NITRIDE; VAPOR DEPOSITION; WEAR RESISTANCE;

EID: 0033503577     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(99)00481-8     Document Type: Article

References (34)

1. Sundgren J.-E. Thin Solid Films. 128:1985;21.
2. Münz W.-D. J. Vac. Sci. Technol. A. 4:(6):1986;2717.
3. Knotek O., Böhmer M., Leyendecker T. J. Vac. Sci. Technol. A. 4:(6):1986;2695.
4. McIntyre D., Greene J.E., Hakansson G., Sundgren J.-E., Münz W.-D. J. Appl. Phys. 67:(3):1990;1542.
5. Kim C.W., Kim K.H. Thin Solid Films. 307:1997;113.
6. Hofmann S., Jehn H.A. Surf. Interface Anal. 12:1988;329.
7. Rogl P., Schuster J.C. Phase Diagrams of Ternary Boron Nitride and Silicon Nitride Systems. 1992;ASM International, Materials Park, OH.
8. Hirai T., Hayashi S. J. Mater. Sci. 17:1982;1320.
9. Li S., Shi Y., Peng H. Plasma Chem. Plasma Process. 12:(3):1992;287.
10. Vepřek S., Reiprich S., Shizhi L. Appl. Phys. Lett. 66:(20):1995;2640.
11. Vepřek S. Pure Appl. Chem. 68:(5):1996;1023.
12. Vepřek S., Reiprich S. Thin Solid Films. 268:1995;64.
13. He J.L., Chen C.K., Hon M.H. Wear. 181-183:1995;189-193.
14. Patscheider J., Li S., Vepřek S. Plasma Chem. Plasma Process. 16:(3):1996;341.
15. Bulting M.J., Otterloo A.F., Montree A.H. J. Electrochem. Soc. 138:1991;500.
16. Diserens M., Patscheider J., Lévy F. Surf. Coat. Technol. 108:1998;241.
17. Vaz F., Rebouta L.M., Ramos S., da Silva M.F., Soares J.C. Surf. Coat. Technol. 108-109:1998;236.
18. Vaz F., Rebouta L.M., Ramos S., Cavaleiro A., da Silva M.F., Soares J.C. Surf. Coat. Technol. 101:1998;110.
19. Sun X., Reid J.S., Kolawa E., Nicolet M.-A. J. Appl. Phys. 81:(2):1997;656.
20. Ijima T., Shimooka Y., Suguro K. Electron. Commun. Jpn. Part 2. 78:(12):1995;67.
21. Sproul W.D., Rudnik P., Graham M., Rohde S. Surf. Coat. Technol. 43-44:1990;270.
22. Window B. Surf. Coat. Technol. 81:1996;92.
23. Oliver W.C., Pharr G.M. J. Mater. Res. 7:(6):1992;1564.
24. Veprek S., Haussmann M., Reiprich S. Mater. Res. Soc. Symp. Proc. 400:1996;261.
25. Wittmer M., Noser J., Melchior H. J. Appl. Phys. 52:(11):1981;6659.
26. Lefort P., Desmaison J., Billy M. J. Less-Common Met. 60:1978;11.
27. Llauro G., Gourbilleau F., Sibieude F., Hillel R. Thin Solid Films. 315:1998;336.
28. Vaz F., Rebouta L., Andritschky M., da Silva M.F., Soares J.C. J. Eur. Ceram. Soc. 17:(15-16):1997;1971.
29. Habraken F.H.P.M., Kuiper A.E.T. Silicon nitride and oxynitride films. Mater. Sci. Eng. R. 12:(3):1994;123-175.
30. Noyan I.C., Cohen J.B. Residual Stresses. 1987;Springer, Heidelberg.
31. Perry A.J., Sue J.A., Martin P.J. Surf. Coat. Technol. 81:1996;17.
32. 2 (rutile), 21-1276.
33. Sproul W.D., Graham M.E., Wong M.-S., Rudnik P.J. Surf. Coat. Technol. 61:1993;139.
34. Goldstein J.I., Choi S.K., Van Loo F.J.J., Bastin G.F., Metselaar R. J. Am. Ceram. Soc. 78:(2):1995;313.