In situ stress evolution during magnetron sputtering of transition metal nitride thin films

Applied Physics Letters

Volumn 93, Issue 11, 2008, Pages

  Abadias, G ^a   Guerin, Ph ^a  

^a UMR 6630   (France)

Author keywords

[No Author keywords available]

Indexed keywords

BEAMS AND GIRDERS; MAGNETIC FILMS; MAGNETRON SPUTTERING; MAGNETRONS; METALS; NITRIDES; REACTIVE SPUTTERING; TENSILE STRESS; THICK FILMS; TIN; TITANIUM COMPOUNDS; TITANIUM NITRIDE; TRANSITION METALS;

BIAS-VOLTAGE; FILM-THICKNESS; IN-SITU STRESSES; NITRIDE THIN FILMS; REACTIVE MAGNETRON SPUTTERING; SPUTTERING PRESSURES; STRESS EVOLUTION; STRESS GENERATION; STRESS GRADIENTS; STRESS REGIMES; STRESS-RELAXATION; TI CONTENT; VOID FORMATIONS; WAFER CURVATURES;

MOLECULAR BEAM EPITAXY;

EID: 52349100717     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2985814     Document Type: Article

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