The evolution of diffusion barriers in copper metallization

JOM

Volumn 59, Issue 1, 2007, Pages 44-49

  Lee, Chiapyng ^a   Kuo, Yu Lin ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; INTEGRATED CIRCUITS; METALLIZING; NITRIDES; REFRACTORY METALS;

COPPER METALLIZATION; DIFFUSION BARRIERS;

COPPER;

EID: 33846500355     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11837-007-0009-4     Document Type: Article

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