3-D hyperintegration and packaging technologies for micro-nano systems

Proceedings of the IEEE

Volumn 97, Issue 1, 2009, Pages 18-30

  Lu, Jian Qiang ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

3 D packaging; Hyperintegration; InfoTech NanoTech BioTech systems; Three dimensional (3 D) integration; Through silicon via; Wafer alignment; Wafer bonding

Indexed keywords

BIOTECHNOLOGY; INDUSTRIAL RESEARCH; INTEGRATION; NANOSYSTEMS; PRODUCT DESIGN; SILICON WAFERS; THREE DIMENSIONAL INTEGRATED CIRCUITS; WAFER BONDING;

3D PACKAGING; HYPERINTEGRATION; INFO-TECH; THREE DIMENSIONAL (3D) INTEGRATION; THROUGH-SILICON-VIA; WAFER ALIGNMENT;

ELECTRONICS PACKAGING;

EID: 61549131161     PISSN: 00189219     EISSN: None     Source Type: Journal    
DOI: 10.1109/JPROC.2008.2007458     Document Type: Article

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