System-on-Package (SOP) technology, characterization and applications

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 415-421

  Knickerbocker, J U ^a   Andry, P S ^a   Buchwalter, L P ^a   Colgan, E G ^a   Cotte, J ^a   Gan, H ^b   Horton, R R ^a   Sri Jayantha, S M ^a   Magerlein, J H ^a   Manzer, D ^a   McVicker, G ^a   Patel, C S ^a   Polastre, R J ^a   Sprogis, E S ^b   Tsang, C K ^a   Webb, B C ^a   Wright, S L ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL SILICON; FINE PITCH AREA ARRAY SOLDER INTERCONNECTIONS; MICROCHANNEL COOLING; SILICON PACKAGE; SYSTEM-ON-PACKAGE (SOP);

ACOUSTIC NOISE; BANDWIDTH; CELLULAR TELEPHONE SYSTEMS; COMPOSITE MATERIALS; COPPER; ELECTRIC CONDUCTORS; ELECTRIC WIRING; ROBUSTNESS (CONTROL SYSTEMS); SEMICONDUCTING SILICON; TUNGSTEN;

ELECTRONICS PACKAGING;

EID: 33845562490     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645680     Document Type: Conference Paper

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