Vertical system integration by using Inter-Chip vias and Solid-Liquid Interdiffusion bonding

Japanese Journal of Applied Physics, Part 2: Letters

Volumn 43, Issue 7 A, 2004, Pages

  Klumpp, Armin ^a   Merkel, Reinhard ^a   Ramm, Peter ^a   Weber, Josef ^a   Wieland, Robert ^a  

^a Munich Division   (Germany)

Author keywords

Copper; Modular; Multilayer; Plugs; Solid liquid interdiffusion; Stack; Tin; Tungsten; Ultra thin

Indexed keywords

CHIP-TO-WAFER STACKING; MODULAR; SOLID-LIQUID INTERDIFFUSION; STACK;

BONDING; COPPER COMPOUNDS; ELECTRIC CONNECTORS; INTEGRATION; INTERDIFFUSION (SOLIDS); MULTILAYERS; STACKING FAULTS; TIN COMPOUNDS; TUNGSTEN COMPOUNDS; ULTRATHIN FILMS; WSI CIRCUITS;

MICROPROCESSOR CHIPS;

EID: 4444275224     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.43.L829     Document Type: Article

References (5)

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