Process integration for through-silicon vias

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 23, Issue 4, 2005, Pages 824-829

  Spiesshoefer, S ^a   Rahman, Z ^a   Vangara, G ^a   Polamreddy, S ^a   Burkett, S ^a   Schaper, L ^a  

^a 3202 Bell Engineering Center   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BACKSIDE PROCESSING; CU SEED FILMS; THROUGH-SILICON VIAS (TSV);

COPPER; ELECTROPLATING; MICROPROCESSOR CHIPS;

SILICON;

EID: 31044437398     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1864012     Document Type: Conference Paper

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