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Semiconductor International
Volumn 30, Issue 6, 2007, Pages
Package-on-package: The story behind this industry hit
Author keywords

[No Author keywords available]
Indexed keywords

EID: 34250737793     PISSN: 01633767     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article
Times cited : (6)
References (4)
  • 1
    • 0038012414 scopus 로고    scopus 로고
    • Design and Stacking of an Extremely Thin Chip-Scale Package
    • A. Yoshida and K. Ishibashi, "Design and Stacking of an Extremely Thin Chip-Scale Package," Proc. of ECTC, 2003, p. 1095.
    • (2003) Proc. of ECTC , pp. 1095
    • Yoshida, A.1    Ishibashi, K.2
  • 2
    • 34250727303 scopus 로고    scopus 로고
    • The Prismark Wireless Technology Report, March 2005.
    • The Prismark Wireless Technology Report, March 2005.
  • 3
    • 34250771343 scopus 로고    scopus 로고
    • The Prismark Wireless Technology Report, July 2006.
    • The Prismark Wireless Technology Report, July 2006.
  • 4
    • 33847657707 scopus 로고    scopus 로고
    • Future Package Technologies for Wireless Communication Systems
    • Nov. 9
    • T. Kamgaing et al., "Future Package Technologies for Wireless Communication Systems," Intel Tech. Journal. Nov. 9, 2005.
    • (2005) Intel Tech. Journal
    • Kamgaing, T.1

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.