-
1
-
-
0034453365
-
Three-Dimensional Shared Memory Fabricated Using Wafer Stacking Technology
-
K. W. Lee, et al., "Three-Dimensional Shared Memory Fabricated Using Wafer Stacking Technology," Intl. Elec. Dev. Meeting (IEDM), 2000, pp. 165-168.
-
(2000)
Intl. Elec. Dev. Meeting (IEDM)
, pp. 165-168
-
-
Lee, K.W.1
-
2
-
-
0033903824
-
A Global Wiring Paradigm for Deep Submicron Design
-
Feb
-
D. Sylvester and K. Keutzer, "A Global Wiring Paradigm for Deep Submicron Design," IEEE Trans. CAD, vol. 19, no. 2, pp. 242-252, Feb. 2000.
-
(2000)
IEEE Trans. CAD
, vol.19
, Issue.2
, pp. 242-252
-
-
Sylvester, D.1
Keutzer, K.2
-
4
-
-
34548043503
-
A Three-Dimensional Stochastic Wire-Length Distribution for Variable Separation of Strata
-
J. W. Joyner, P. Zarkesh-Ha, J. A. Davis, and J. D. Meindl, "A Three-Dimensional Stochastic Wire-Length Distribution for Variable Separation of Strata," Intl. Interconnect Tech. Conf. (IITC), 2000, pp. 126-128.
-
(2000)
Intl. Interconnect Tech. Conf. (IITC)
, pp. 126-128
-
-
Joyner, J.W.1
Zarkesh-Ha, P.2
Davis, J.A.3
Meindl, J.D.4
-
5
-
-
0033719714
-
An Integrated Architecture for Global Interconnects in a Gigascale System-on-a-Chip (GSoC)
-
P. Zarkesh-Ha and J. D. Meindl, "An Integrated Architecture for Global Interconnects in a Gigascale System-on-a-Chip (GSoC)," Symp. VLSI Technology, 2000, pp. 194-195.
-
(2000)
Symp. VLSI Technology
, pp. 194-195
-
-
Zarkesh-Ha, P.1
Meindl, J.D.2
-
6
-
-
0034592573
-
Prediction of Interconnect Fan-Out Distribution Using Rent's Rule
-
P. Zarkesh-Ha, J. A. Davis, W. Loh, and J. D. Meindl, "Prediction of Interconnect Fan-Out Distribution Using Rent's Rule," Intl. Workshop on System-Level Interconnect Prediction (SLIP), 2000, pp. 107-112.
-
(2000)
Intl. Workshop on System-Level Interconnect Prediction (SLIP)
, pp. 107-112
-
-
Zarkesh-Ha, P.1
Davis, J.A.2
Loh, W.3
Meindl, J.D.4
-
7
-
-
0034459340
-
Prediction of Net Length Distribution for Global Interconnects in a Heterogeneous System-on-a-Chip
-
To be published Dec.
-
P. Zarkesh-Ha, J.A. Davis, and J.D. Meindl, "Prediction of Net Length Distribution for Global Interconnects in a Heterogeneous System-on-a-Chip," To be published IEEE Trans. VLSI Systems, Dec. 2000.
-
(2000)
IEEE Trans. VLSI Systems
-
-
Zarkesh-Ha, P.1
Davis, J.A.2
Meindl, J.D.3
-
8
-
-
0034317044
-
Compact Distributed RLC Interconnect Models: Parts I and II
-
Nov
-
J. A. Davis and J. D. Meindl, "Compact Distributed RLC Interconnect Models: Parts I and II," IEEE Trans. Elec. Dev., vol. 47, no. 11, pp. 2068-2087, Nov. 2000.
-
(2000)
IEEE Trans. Elec. Dev.
, vol.47
, Issue.11
, pp. 2068-2087
-
-
Davis, J.A.1
Meindl, J.D.2
|