Opportunities for reduced power dissipation using three-dimensional integration

Proceedings of the IEEE 2002 International Interconnect Technology Conference, IITC 2002

Volumn , Issue , 2002, Pages 148-150

  Joyner, J W ^a   Meindl, J D ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

THREE DIMENSIONAL INTEGRATED CIRCUITS;

INTERCONNECT CAPACITANCE; INTERCONNECT POWER; REDUCING POWER; SQUARE ROOTS; THREE DIMENSIONAL INTEGRATION;

ELECTRIC LOSSES;

EID: 84961696384     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2002.1014915     Document Type: Conference Paper

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