Low-temperature titanium-based wafer bonding

Journal of the Electrochemical Society

Volumn 154, Issue 1, 2007, Pages

  Yu, Jian ^a   Wang, Yinmin ^b   Moore, Richard L ^c   Lu, Jian Qiang ^a   Gutmann, Ronald J ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

^c STATE UNIVERSITY OF NEW YORK   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHIZATION; AUGER ELECTRON SPECTROSCOPY; LOW TEMPERATURE EFFECTS; REACTION KINETICS; TITANIUM; TRANSMISSION ELECTRON MICROSCOPY;

GRAIN EXTRUSION; INTERFACIAL REDUCTION REACTION; SOLID STATE AMORPHIZATION;

CHEMICAL BONDS;

EID: 33845245599     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2388851     Document Type: Article

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