MEMS capacitive accelerometers

Sensor Letters

Volumn 5, Issue 3-4, 2007, Pages 471-484

  Biswas, Karabi ^a   Sen, Siddhartha ^b   Dutta, Pranab Kumar ^b  

^a JADAVPUR UNIVERSITY   (India)

^b INDIAN INSTITUTE OF TECHNOLOGY   (India)

Author keywords

Fabrication; MEMS capacitive accelerometer; Noise analysis; Optimization; Packaging; Signal conditioning circuit; Simulation tools; Structural design

Indexed keywords

COMPUTER SIMULATION; MEMS; NUMERICAL ANALYSIS; OPTIMIZATION; SIGNAL PROCESSING;

CAPACITANCE ACCELEROMETERS; SIGNAL CONDITIONING CIRCUIT;

ACCELEROMETERS;

EID: 37349058710     PISSN: 1546198X     EISSN: None     Source Type: Journal    
DOI: 10.1166/sl.2007.201     Document Type: Review

References (167)

1. J. Geen, S. Sherman, J. Chang, and S. Lewis, IEEE J Solid State Circuits 37, 1860 (1999).
2. V. P. Petkov and B. E. Boser, Enablig Technology for MEMS and Nanodevices, Wiley-VCH Verlag GmbH and Co., KGaA (2004), Chap. 3, p. 49.
3. M. Lemkin and B. E. Boser, IEEE J. Solid-State Circuits 34 (1999).
4. Analog Devices One Technology Way, P.O. Box 9106, Norwood. MA 02062-9107, USA, Monolithic Accelerometer with Signal Conditioning: Datasheet, ADXL50.
5. L. K. Baxter, Capacitive Sensors Design and Application, IEEE Press, New York (1997).
6. J. M. Bustillo, R. T. Howe, and R. S. Muller, Proc. IEEE 86, 1552 (1998).
7. K.-Y. Park, C.-W. Lee, H.-S. Jang, Y. Oh, and B. Ha, Sens. Actuators A: Phys.73, 109 (1999).
8. B. V. Amini, S. Pourkamali, and F. Ayazi, Proc. IEEE MEMS '04, 572(2004).
9. F. E. H. Tay, J. Xu, and V. J. Logeeswaran, Sens. Actuators 86, 45 (2000).
10. K. H. L. Chan, S. R. Lewis, Y. Zhao, R. Howe, S. F. Bart, and R. G. Marcheselli, Sens. actuators A 54, 472 (1996).
11. L. Zimmermann, J. P. Ebersohl, F. L. Hung, J. P Berry, F. Baillieu, P. Rey, B. Diem, S. Renard, and P. Caillat, Sens. Actuators A: Phys. 46-47, 190 (1995).
12. A. Selvakumar, Farrokh, and K. Najafi, International Electron Devices Meeting (IEDN '96), San Francisco, CA (1996).
13. O. Kromer, O. Fromhein, H. Gemmeke, T. Kuhner, J. Mohr, and M. Strohmann, Sens. Actuators A: Phys. 46-47, 196 (1995).
14. V. Josselin, P. Touboul, and R. Kielbasa, Sens. Actuators A: Phys. 78, 92 (1999).
15. B. Li, D. Lu, and W. Wang, Sens. Actuators A: Phys. 79, 219 (2000).
16. H. Goldberg, J. Gannon, and J. Marsh, Sensors Online 18 (2001).
17. A. Béliveau, G. T. Spencer, K. A. Thomas, and S. L. Roberson, IEEE Design Test of Computers (1999).
18. M. Kraft, C. Lewis, T. Hesketh, and S. Szymkowiak, Sens. Actuators A: Phys. 68, 466 (1998).
19. N. Yazdi, K. Najafi, and A. S. Salian, J. Microelectromechanical Systems 12, 479 (2003).
20. Analog Devices One Technology Way, PO. Box 9106, Norwood. MA 02062-9107, USA,±1 G to +5 G Single Chip Accelerometer with Signal Conditioning, ADXL05.
21. S. Iyer, Y. Zhou, and T. Mukherjee, Technical Proceedings of the 1999 International Conference on Modelling and Simulation of Microsystems 632 (1999).
22. F. Han, Z. Gao, and Y. Wang, Sens. Actuators A 99, 249 (2002).
23. R. Houlihan, A. Kukharenka, M. Gindila, and M. Kraft, Proceedings of SPIE Conference on Reliability, Testing and Characterization of MEMS/ MOEMS, San Francisco, 277 (2001).
24. H. Luo, G. Zhang, L. R. Carley, and G. K. Fedder, J. MicroElectroMechanical System 11, 185 (2002).
25. MEMS Accelerometer Technology Report, Technical report Silicon Designs, Inc., http://www.silicondesigns.com/anachip.html (2003).
26. S. Lee, G.-J. Nam, J. Chae, H. Kim, and A. J. Drake, Des. Autom. Conference 852 (2001).
27. H. Kulah, J. Chae, and K. Najafi, Digest, International Conference in Solid-State Sensors and Actuators (TRANSDUCERS '03) 92 (2003).
28. E. Gaura and M. Kraft, Technical Proceedings of the 2002 International Conference on Modeling and Simulation of Microsystems 1, 154 (2002).
29. MEMS Accelerometer Technology Report, Technical Report Silicon Designs, Inc., http://www.silicondesigns.com/digchip.html (2003).
30. J. Wu, G. K. Fedder, and L. R. Carley, IEEE J. Solid State Circuits 39 (2004).
31. J. Doscher, Using iMEMS Accelerometers in Instrumentation Applications, One Technology Way, P.O. Box 9106, Norwood, MA 02062-9107, USA.
32. A. Gola, N. Bagnalasta, P. Bendisciolli, and A. Baschirotto, 27th European Solid-State Circuits Conference (2001).
33. G. Zhang, Design and Simulation of CMOS-MEMS Accelerometer, Master's Thesis, Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburg, PA (1998).
34. T. Kajita, U.-K. Moon, and G. C. Temes, IEEE Transactions on Instrumentation and Measurement 51 (2002).
35. C. Lu, M. Lemkin, and B. E. Boser, IEEE J. Solid State Circuits 30 (1995).
36. MEMS Accelerometer Technology Report, Technical Report Silicon Designs, Inc., http://www.silicondesigns.com/tech.html (2003).
37. K. Kwon and S. Park, Sens. Actuators: A 66, 250 (1998).
38. Y. Matsumato, M. Nishimuro, M. Matsuura, and M. Ishida, Sens. Actuators: A 75, 77 (1999).
39. H. Takao, H. Fukumoto, and M. Ishida, IEEE Transactions on Electron Devices 48, 1961 (2001).
40. N. Yazdi, F. Ayazi, and K. Najafi, Proc. IEEE 86, 1640 (1999).
41. M. Kraft, MEMS Capacitive Accelerometer, Ph.D. Thesis, School of Engineering, University of Coventry, Priory St, CV1 5FB, UK (1997).
42. C. H. Mastrangelo and C. H. Hsu, J. Micromechanical Systems 2, 131 (1993).
43. M. Kraft, C. Lewis, T. Hesketh, and S. Szymkowiak, Sens. Actuators A: Phys. 68, 466 (1998).
44. G. K. Fedder and T. Mukherjee, Proc. 5th ACM/SIGDA Physical Design Workshop 53 (1996).
45. J. Kim, S. Seok, B. Lee, S. Kim, J. Park, I. Lee, G. Yoon, and K. Chun, Proceedings of International Conference on Electrical Engineering, Korean Institute of Electrical Engineering, 1307 (2002).
46. H. Xie and G. K. Fedder, Sens. Actuators A: Phys. 95, 212 (2002).
47. K. Biswas, S. Sen, and P. K. Dutta, Proc. 15th Micromechanics Europe Workshop, Leuven, Belgium, 61 (2004).
48. G. T. A. Kovacs, N. I. Maluf, and K. E. Peterson, invited paper: Proc. IEEE 86, 1536 (1998).
49. T.-R. Hsu, MEMS and Microsystems Design and Manufacture, Tata McGraw Hill, New Delhi (2002).
50. O. Brand, CMOS-MEMS, Wiley-VCH Verlag GmbH and Co., KGaA (2004), Chap. 1, p. 1.
51. J. Fraden, Handbook of Modem Sensors, AIP Press, Springer-verlag, New york (2003).
52. S. M. Sze, Semiconductor Devices-Physics and Technology, John Wiley and Sons, New york (1985).
53. S. Tung, An Overview of MEMS Inertial Sensors, Technical report National Science Foundation, Orland, FLorida (2000).
54. R. S. Payne, S. Sherman, S. Lewis, and R. T. Howe, IEEE Integrated Solid-State Circuits Conference 164 (1995).
55. R. T. Howe, J. Vaccuum Science and Technology 6, 1809 (1998).
56. R. T. Howe, B. E. Boser, and A. P. Pisano, Sens. Actuators: A 56, 167 (1996).
57. V. Gupta and T. Mukherjee, Third International Conference on Modelling and Simulation of Microsystems, 150 (2000).
58. W. C. Tang, 34th Design Optimization Conference, 670 (1997).
59. G. K. Fedder, Twelfth IEEE International Conference on Micro Electro Mechanical Systems 1 (1999).
60. Structured Design Methods for MEMS, Final Workshop Report, California Institute of Technology, Division of Engineering and Applied Science (1996).
61. T. Mukherjee, Y. Zhou, and G. K. Fedder, Proc. IEEE MEMS '99 326 (1999).
62. Y. Zhou, Layout Synthesis of Accelerometers, Master's Thesis, Department of Electrical and Computer Engineering, Carnegie Mellon University, Pittsburg, PA 15203-3890 (1998).
63. Z. Juneidi, K. Torki, B. Charlot, and B. Courtois, Tima Lab. Research Reports: MEMS Synthesis and Optimization, Technical report Tima Laboratory 46 avenue Felix Viallet, 38000 Grenoble France (2004).
64. T. Mukherjee and G. K. Fedder, 1997 Design Automation Conference 680 (1997).
65. T. Mukherjee, S. Iyer, and G. K. Fedder, Sensors and Actuators: A 70, 118 (1998).
66. S. Iyer, T. Mukhedee, and G. K. Fedder, Proceedings of the 1998 International Conference on Modelling and Simulations of Micosystems, Semiconductors, Sensors and Actuators (1998).
67. H. Krassow, M. Zabala, A. Gotz, and C. Cane, Technical Proceedings of the 1998 International Conference on Modelling and Simulation of Microsystems, 329 (1998).
68. N. Zhou, A. Agogino, and K. S. J. Pister, Proceedings of DETC 2002: Design Automation, Montreal, Canada, 61 (2002).
69. O. Nagler, M. Trost, B. Hillerich, and F. Kozlowski, Sens. Actuators A 66, 15 (1998).
70. N. Zhou, A. Agogino, and K. S. J. Pister, Proceedings of ANNIE 2001, Intelligent Engineering Systems through Artificial Neural Networks 11 (2001).
71. W. Ye, S. Mukhedee, and N. C. Macdonald, J. MicroElectroMechanical System 7, 16 (1998).
72. W. Ye and S. Mukherjee, Computer Modelling in Engineering and Sciences 1, 111 (2000).
73. S. D. Senturia, R. Harris, S. Kim, K. Nabors, M. Shulman, and J. White, J. MicroElectroMechanical System 1, 3 (1992).
74. Y. Zhang, S. B. Cary, and K. D. Wise, Pressure sensor design and simulation using the CAMEMS-D module, Technical Digest of the IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC (1990).
75. B. Puers, E. Peterson, and W. Sansen, Sens. Actuators: A A17, 423 (1989).
76. B. Folkmer, H.-L. Offereins, and H. Sandmaier, Sens. Actuators: A A32, 521 (1992).
77. G. K. Fedder, Simulation of Micromechanical Systems, Ph.D. Thesis, Department of Electrical Engineering and Computer Science, University of California, Barkeley, CA 94720 (1994).
78. Reference Manual of CoventorWare Inc., Cary, NC, http://www.coventor.com.
79. Intellisense Corporation 16 Upton Dr., Wilmington, MA 01887, IntelliCAD.
80. O. Bochobza-Degani and Y. Nemirovsky, Sens. Actuators: A 97-98, 569 (2002).
81. M. Fischer, M. Giousouf, J. Schaepperle, D. Eichner, and M. Weinmann, Sens. Actuators A 67, 89 (1998).
82. ABAQUS, http://www.hks.com, Hibbit, Karlsson and Sorensen Ins., 1080 Main Street, Pawtucket, RI 02860.
83. M. H. W. Bonse, C. Mul, and J. W. Spronck, Sens. Actuators A 46-47, 266 (1995).
84. J. V. Clark and N. Zhou, Proceedings of the 15th IEEE MEMS Conference 204 (2002).
85. G. K. Fedder and Q. Jing, Proceedings IEEE/VIUF International Workshop on Behavioral Modelling and Simulation (1998).
86. J. V. Clark, N. Zhou, S. Brown, and K. S. J. Pister, Solid-State Sensors and Actuators Workshop 191 (1998).
87. I. Getreu, Proceedings of Microwave Circuits and Systems 977 (1989).
88. D. Moulinier, M.-P. Brutails, and S. Bergeon, Proceedings of the Technical Conference, SAME 2001 1 (2001).
89. H. Hasanuzzaman and C. H. Masterangelo, Technical Digest of the 8th International Conference on Solid-State Sensor and Actuators (Transducers '95) 1 (1995).
90. R. A. Buser, D. Rooji, and N. F. Asep, Sens. Actuators A 28, 71 (1990).
91. G. Delapierre, Sens. Actuators 31, 267 (1992).
92. J. Fruhauf, K. Trautmann, J. Wittig, and D. Zeilke, J. Micomechanics and Microengineering 3, 113 (1993).
93. B. Puers and W. Sansen, Sens. Actuators A 21-23, 1036 (1990).
94. C. H. Sequin, Transducers '91, 801 (1991),
95. Y. Matsumato and M. Esashi, Technical Digest, 7th Internatinal Conference in Solid-State Sensors and Actuators (TRANSDUCERS '93) 826 (1993).
96. C. Hierold, A. Hildebrandt, U. Naher, T. Scheiter, B. Mesching, M. Steger, and R. Tiefert, Sens. Actuators A: Phys. 57, 111 (1996).
97. W. Yun, R. T. Howe, and P. R. Gray, Technical Digest, Solid-State Sensors, and Actuator Workshop 126 (1992).
98. J. J. Allen, R. D. Kinney, J. Sarsfield, M. Daily, J. Ellis, J. Smith, S. M. R. T. Howe, B. E. Boser, R. Horowitz, A. Pisano, M. A. Lemkin, W. Clark, and T. Juneau, IEE Aes Sys Magazine (1998).
99. D. J. Coe, J. M. English, T. J. Kaiser, and R. G. Lindquist, Sensors Lett. 4, 215 (2006).
100. A. Gaiber, W. Geiger, T. Link, S. Steigmajer, A. Hauser, H. Sandmaier, W. Lang, and N. Niklasch, Sens. Actuators A 97-98, 557 (2002).
101. G. K. Fedder, J. Chae, K. Najafi, T. Dension, and H. Kulah, CMOS-MEMS, Wiley-VCH Vertag GmbH and Co., KGaA (2004), Chap. 3, p. 137.
102. T. Smith, O. Nys, M. Chevroulet, Y. DeCoulon, and M. Degrauwe, Technical Digest IEEE International Solid-State Circuits Conference (ISSC '94) 160 (1994).
103. W. Henrion, L. DiSanza, M. Ip, S. Terry, and H. Jerman, Technical Digest of the IEEE Solid-State Sensor and Actuator Workshop 153 (1990).
104. H. Leuthold and F. Rudolf, Sens. Actuators: A A21/A23, 278 (1990).
105. S. Suzuki and S. Tuchitani, Sens. Actuators: A A21/A23, 316 (1990).
106. M. Handtmann, R. Aigner, A. Meckes, and G. K. M. Wachutka, Sens. Actuators: A 97-98, 153 (2002).
107. Y. D. Coulon, T. Smith, J. Hermann, M. Chevroulet, and F. Rudolf, Technical Digest of 7th International Conference on Solid-State Sensors and Actuators (Transducers '93) 832 (1993).
108. L. Spangler and C. J. Kemp, Technical Digest of 8th International Conference on Solid-State Sensors and Actuators (transducers '95) 585 (1995).
109. C. Hagleitner and K.-U. Kirstein, CMOS-MEMS, Wiley-VCH Verlag GmbH and Co., KGaA (2004), Chap. 11, p. 513.
110. M. Brandl and V. Kempe, IEEE International Conference on Micro Electro Mechanical Systems 6 (2001).
111. G. K. Fedder, S. Santhanam, M. L. Reed, S. C. Eagle, D. F. Guillou, M. S.-C. Lu, and L. R. Carley, Sens. Actuators A: Phys. 57, 103 (1996).
112. J. Chae, High-Sensitivity, Low-Noise, Multi-Axis Capacitive Micro Accelerometer, Ph.D. Thesis, University of Michigan, Ann Arbor, Michigan (2003).
113. J. Smith, S. Montague, J. Sniegowski, J. Muray, and P. McWhorter, Proceedings of IEEE IEDM '95 609 (1995).
114. Y. B. Gianchandani, H. Kim, M. Shinn, B. Ha, B. Lee, K. Najafi, and C. Song, J. Micomechanics and Microengineering 10, 380 (2000).
115. M. W. Judy, Technical Digest of the IEEE Solid-State Sensor, Actuator and Microsystem Workshop 27 (2004).
116. M. A. Lemkin, T. Juneau, W. Clark, and T. A. Roessig, Transducers '99 1294 (1999).
117. J. Yasaitis, M. Judy, T. Brosnihan, P. Garone, N. Pokrovskiy, D. Sniderman, S. Limb, R. Howe, B. Boser, M. Palaniapan, X. Jiang, and S. Bhabe, Proceedings of SPIE 4979, 145 (2003).
118. C. Hierold, A. Hildebrandt, U. Naher, T. Scheiter, B. Mensching, M. Steger, and R. Tietert, Proceedings IEEE Micro Electro Mechanical Systems Workshop (MEMS '96) 174 (1996).
119. M. Offenberg, F. Lamer, B. Elsner, H. Munzel, and W. Riethmuller, Transducers '95 589 (1995).
120. Y. Yee, J. U. Bu, K. Chun, and J.-W Lee, J. Micromechanics and Microengineering 10, 350 (2000).
121. Synopsys, Mountain View, CA, http://www.synopsys.com/
122. Cadence Design Systems, San Jose, CA, http://www.cadence.com/
123. Mentor Graphics, Wilsonville, OR, http://www.mentor.com/
124. T. Mukherjee, G. K. Fedder, and R. D. Blanton, IEEE Design Test Computation 16, 18 (1999).
125. SUGAR, http://www-bsac.eecs.berkeley.edu/cadtools/sugar/
126. C. Hagleitner, A. Hierlemann, and H. Baltes, CMOS Single -Chip Gas Detection Scheme: Part II, Wiley-VCH, Weinheim (2003), p. 12.
127. Y. C. Lee, B. A. Parviz, J. A. Chiou, and S. Chen, IEEE Transactions on Advanced Packaging 26, 217 (2003).
128. K. Petersen, Solid-State Sensors and Actuators Workshop 60 (2000).
129. NSF Workshop on Manufacturing of Micro-Electro-Mechanical Systems, Technical Report Orlando, Florida (2000).
130. V. M. Bright, C. R. Stoldt, D. J. Monk, M. Chapman, and A. Salian, Enablig Technology for MEMS and Nanodevices, Wiley-VCH Verlag GmbH and Co., KGaA (2004).
131. J. C. Lyke, Microenineering Technologies for Space System, Aerospace Corp., El Segundo, CA (1985).
132. K. Najafi, Proceedings of SPIE 4979, 1 (2003).
133. J. Chae, H. Kulah, and K. Najafi, 12th International Conference on Solid-State Sensors Actuators Microsystems (Transducer '03) 81 (2003).
134. R. N. Candler, W.-T. Park, H. Li, G. Yama, A. Partridge, M. Lutz, and T. W. Kenny, IEEE Transactions on Advanced Packaging 26, 227 (2003).
135. G. Gary, A. A. Ampere, and A. Tseng, IEEE Transactions on Electronics Packaging Manufacturing 24, 18 (2000).
136. W. H. Ko, J. T. Suminto, and G. J. Yeh, Micromachining and Micropackaging of Transducers, Elsevier Science, Amsterdam (1985).
137. M. Madou, Fundamentals of Microfabrication, CRC Press, Boca Raton, FA (1997).
138. G. Kelly, J. Alderman, C. Lyden, J. Barett, and A. Morrissey, Micromachined Devices and Components, SPIE Proceedings Series, Austin, TX (1997).
139. E. Koen, Pourahmadi, and S. Terry, Tech. Digest, 8th International conference on Solid State Sensor and Actuators (Transducers '95) 273 (1995).
140. D. R. Sparks, S. Massoud-Ansari, and N. Najafi, IEEE Transactions on Advanced Packaging 26, 277 (2003).
141. F. Rudolf, A. Jornod, J. Berqovist, and H. Leuthold, Sens. Actuators: A A21/A23, 297 (1990).
142. M. L. Kniffin and M. Shah, International J. Microcircuits and Electronic Packaging 19, 75 (1996).
143. W. M. Stalnaker, L. J. Spangler, G. S. Fehr, and G. Fujimoto, International Symposium on Microelectronics 197 (1997).
144. L. T. Manzione, Plastic Packaging of Microelectronic Devices, Van Nostrand Reinhold, New York (1990).
145. ALGOR, http://www.algor.com/
146. J. R. Gilbert, Computer 31, 99 (1998).
147. Z. Djuric, Microelectronic Reliablity 40, 919 (2000).
148. F. Mohd-Yasin, C. E. Korman, and D. J. Nagel, Solid-State Electronics 47, 357 (2003).
149. T. B. Gabrielson, IEEE Transactions on Electron Devices 40, 903 (1993).
150. Y. K. Thong, M. S. Woolfson, J. A. Crowe, B. R. Hayes-gill, and D. A. Jones, Measurement 36, 73 (2004).
151. T. Veijola and M. Turowski, J. MicroElectroMechanical System 10, 263 (2001).
152. F. N. Hooge, IEEE Transactions on Electron Devices 41, 1925 (1994).
153. P. E. Allen and D. R. Holberg, CMOS Analog Circuit Design, Oxford University Press (1992), 2nd edn.
154. J. Chae, H. Kulah, and K. Najafi, Proceedings of IEEE MEMS '03 466 (2003).
155. B. E. Boser and R. T. Howe, IEEE J. Solid State Circuits 31, 366 (1996).
156. J. B. Starr, Tech. Digest, IEEE Solid State Sensor and Actuators Workshop (1990).
157. M. Andrews, I. Harris, and G. Turner, Sens. Actuators: A A36, 79 (1993).
158. N. Yazdi and K. Najafi, J. Microelectromechanical Systems 9, 544 (2000).
159. J. C. Lotters, J. G. Bomer, A. J. Verloop, E. A. Droog, W. Olthuis, and P. H. Veltink, Sens. Actuators A 66, 205 (1998).
160. Y.-H. Cho, B. M. Kwak, A. P. Pisano, and O. T. Howe, Sens. Actuators A 40, 31 (1994).
161. A. G. Jordan, IEEE Transactions on Electron Devices 148 (1965).
162. H. Halladay, Proceedings of IEEE 52, 1671 (1963).
163. G. E. Bulman, V. M. Robbins, and G. E. Stillman, IEEE Transactions on Electron Devices 32, 2454 (1985).
164. A. Scholten, L. Tiemeijer, R. van Langevelde, R. Havens, A. Z. van Duijnhoven, V. Venezia, and D. Klaassen, Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show 2, 286 (2003).
165. A. V. D. Ziel, IEEE Transactions on Microwave Theory and Techniques 36, 1 (1988).
166. J. Bernstein, R. Miller, W. Kelley, and P. Ward, J. Micromechanical Systems 8, 433 (1999).
167. N. Bandwar, MEMS Capacitive Accelerometer: Noise Analysis, Master's Thesis, Department of Electrical Engineering, Indian Institute of Technology, Kharagpur (2005).