Laminated high-aspect-ratio microstructures in a conventional CMOS process

Sensors and Actuators, A: Physical

Volumn 57, Issue 2, 1996, Pages 103-110

  Fedder, Gary K ^a,b   Santhanam, Suresh ^a   Reed, Michael L ^a   Eagle, Steven C ^a   Guillou, David F ^a   Lu, Michael S C ^a   Carley, L Richard ^a  

^a CARNEGIE MELLON UNIVERSITY   (United States)

^b CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

CMOS process; High aspect ratio microstructures

Indexed keywords

ACTUATORS; ASPECT RATIO; COMPUTER SIMULATION; DRY ETCHING; ELASTIC MODULI; ELECTROSTATICS; FINITE ELEMENT METHOD; LAMINATES; METALLIZING; NATURAL FREQUENCIES; RESIDUAL STRESSES; STRAIN;

ELECTROSTATICALLY ACTUATED MICROSTRUCTURES; LAMINATED BEAM SUSPENSIONS;

CMOS INTEGRATED CIRCUITS;

EID: 0030282352     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(97)80100-8     Document Type: Article

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