Adhesives in micromechanical sensor packaging

VTT Publications

Volumn , Issue 407, 2000, Pages

  Rusanen, Outi ^a  

^a VTT TECHNICAL RESEARCH CENTRE OF FINLAND   (Finland)

Author keywords

Electronics packaging; Isotropically conductive adhesives; Lifetime estimation; MEMS; Thermal stress; Viscoelasticity

Indexed keywords

EID: 27144485480     PISSN: 12350621     EISSN: None     Source Type: Book Series    
DOI: None     Document Type: Article

References (111)

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