Correlation of thermo-mechanical properties of adhesives with reliability of FC interconnections

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998

Volumn 1998-September, Issue , 1998, Pages 299-304

  Miessner, R ^a   Aschenbrenner, R ^a   Reichl, H ^a  

^a Fraunhofer Znstitut fur Zuverhssigkeit und Mikrointegmtion   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; ADHESIVES; ANISOTROPY; COATINGS; CONDUCTIVE MATERIALS; CURING; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; JOINING; MECHANICAL PROPERTIES; RELIABILITY;

ANISOTROPIC CONDUCTIVE ADHESIVES; ELECTRICALLY CONDUCTIVE PARTICLE; ISOTROPIC AND ANISOTROPIC CONDUCTIVE ADHESIVES; ISOTROPIC CONDUCTIVE ADHESIVES; RIGID AND FLEXIBLE SUBSTRATES; TEMPERATURE AND HUMIDITIES; THERMO-MECHANICAL ANALYSIS; THERMOMECHANICAL PROPERTIES;

SUBSTRATES;

EID: 4444245537     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.1998.742045     Document Type: Conference Paper

References (7)

1. S. Kotthaus et al.: Current-Induced Degradation of Isotropically Conductive Adhesives", PEP'97 Proceedings.
2. C.P. Wong et al.: Fundamental Study of Electrically Conductive Adhesives". PEP'97 Proceedings.
3. R. Aschenbrenner et al.: Evaluation of Adhesive Flip Chip Bonding on Flexible Substrates". Flexcon'9 Proceedings.
4. A. Schubert: Thermo-Mechanical Reliability of Flip-Chip Structures Used in DCA and CSP". Advanced Packaging Materials, March 15-18. Braselton GA
5. K.-F. Becker et al.: Influences on the Reliability of Underfilled Flip Chips", ITAP:97 Proceedings
6. R. Yoshino et al.: .,Development of Low Cost and Reliable Resin Based Press Contact Technology". IEMT/EMC Proceedings 1997.
7. G. Habenicht: .,Kleben". Springer-Verlag. Berlin. New York, 1990.