Future of IC microtransducers

Sensors and Actuators, A: Physical

Volumn 56, Issue 1-2, 1996, Pages 179-192

  Baltes, Henry ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

Bipolar sensors; Building control; CMOS sensors; Flow sensors; Infrared sensors; Magnetic sensors; Microtransducer design tools; Microtransducer parameter extraction; Proximity sensors; Thermoelectric conversion; Ultrasound; Ultraviolet detectors; Vacuum gauges

Indexed keywords

ACTUATORS; ANGLE MEASUREMENT; BIPOLAR INTEGRATED CIRCUITS; CMOS INTEGRATED CIRCUITS; FLOW MEASUREMENT; MAGNETIC FIELD MEASUREMENT; MICROMACHINING; SENSORS; THERMOELECTRIC ENERGY CONVERSION; THIN FILMS; TRANSDUCERS; ULTRAVIOLET DETECTORS;

INTEGRATED CIRCUIT MICROTRANSDUCERS; SOFTWARE PACKAGE ICMAT; SOFTWARE PACKAGE SOLIDIS;

MICROELECTROMECHANICAL DEVICES;

EID: 0030206050     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/0924-4247(96)01278-2     Document Type: Article

References (75)

1. L. Esaki and G. Soncini (eds.), Large Scale Integrated Circuits Technology: State of the Art and Prospects, Marinus Nijhoff Publishers, The Hague, 1982.
2. S. Middelhoek and D.J.W. Noorlag, Silicon microtransducers, J. Phys. E: Sci. Instrum., 14 (1981) 1343-1352.
3. H. Baltes, CMOS as sensor technology, Sensors and Actuators A, 37-35 (1993) 51-56.
4. H. Baltes, O. Brand, J.G. Korvink, R. Lenggenhager and O. Paul, IMEMS - integrated micro electro mechanical systems by VLSI and micromachining, Proc. 24th Eur. Solid State Device Research Conf., ESSDERC, Edinburgh, UK, 11-15 Sept., 1994, pp. 273-280.
5. H. Baltes and C. Azeredo Lerne, Sensors in microsystems, in H. Meixner and R. Jones (eds.), Sensors 8: Micro- and Nanosensor Technology/Trends in Sensor Markets, VCH, Weinheim, 1995, pp. 51-77.
6. H. Baltes, Integrated micro electro mechanical systems, Elektrotechnik und Informationstechnik, 112 (1995) 488-492.
7. H. Baltes, J.G. Korvink and O. Paul, Numerical modeling and materials characterisation for intergrated microelectromechanical systems, Simulation Semiconductor Devices Processes, 6 (1995) 1-9.
8. H. Baltes and O. Paul, Thermal sensors by CMOS and micromachining, Sensors Mater., 8 (1996) in press.
9. H. Baltes, O. Paul and D. Jaeggi, Thermal CMOS sensors - an overview, Sensors Update, 1 (1996) in press.
10. P. Malcovati, F. Maloberti and H. Baltes, Progress in microsensor interfaces, Sensors Update, 1 (1996) in press.
11. J.G. Korvink and H. Baltes, Simulation of CMOS Sensors, Sensors Update, I (1996) in press.
12. V. Zieren and B.P.M. Duijndam, Magnetic-field-sensitive multicollector npn transistors, IEEE Trans. Electron Devices, 29 (1982) 83-90.
13. R. Castagnetti, Integrated magnetotransistors in bipolar and CMOS technology, Ph.D Thesis No. 10 751, ETH Zurich (1994).
14. C. Riccobene, Multidimensional analysis of galvanomagnetic effects in magnetotransistors, Ph.D. Thesis No. 11 077, ETH Zurich (1995).
15. A. Häberli, M. Schneider, P. Malcovati, R. Castagnetti, F. Maloberti and H. Baltes, 2D magnetic microsensor with on-chip signal processing for contactless angle measurement, Tech. Digest, IEEE Int. Solid-State Circuit Conf., ISSCC, San Francisco, CA, USA, 8-10 Feb., 1996, pp. 332-333.
16. H. Baltes and R. Castagnetti, Magnetic sensors, in S.M. Sze (ed.), Semiconductor Sensors, Wiley, New York, 1994, pp. 205-269.
17. E.R. Fossum, CMOS image sensors: electronic camera on a chip, Tech. Digest, IEEE Int. Electron Devices Meet., Washington, DC, USA, 10-13 Dec., 1995, pp. 17-25.
18. T. Boltshauser, CMOS humidity sensors, Ph.D. Thesis No. 10320, ETH Zurich (1993).
19. C. Cornila, A. Hierlemann, R. Lenggenhager, P. Malcovati, H. Baltes, G. Noetzel, U. Weimar and W. Göpel, Capacitive sensors in CMOS technology with polymer coating, Sensors and Actuators B, 24-25 (1995) 357-361.
20. T. Boltshauser, C. Azeredo Lerne and H. Baltes, Humidity sensors with on-chip absolute capacitance measurement system, Sensors and Actuators B, 15-16 (1992) 75-80.
21. M. Schneider, R. Castagnetti, M.G. Allen and H. Baltes, Integrated flux concentrator improves CMOS magnetotransistor, Proc. IEEE Micro Electro Mechanical Systems, MEMS, Amsterdam, Netherlands, 29 Jan-2 Feb., 1995, pp. 151-156.
22. R. Lenggenhager, CMOS thermoelectric infrared sensors, Ph.D. Thesis No. 10 744, ETH Zurich (1994).
23. R. Lenggenhager, D. Jaeggi, P. Malcovati, H. Duran, H. Baltes and E. Doering, CMOS membrane infrared sensor and improved TMAHW etchant, Tech. Digest, IEEE Int. Electron Devices Meet., San Francisco, CA, USA, 11-14 Dec., 1994, pp. 531-534.
24. O. Paul, A. Häberli, P. Malcovati and H. Baltes, Novel integrated thermal pressure gauge and read-out circuit by CMOS IC design, Tech. Digest, IEEE Int. Electron Devices Meet., San Francisco, CA, USA, 11-14 Dec., 1994, pp. 131-134.
25. M. Parameswaran, H. Baltes, A.M. Robinson, Polysilicon microbridge fabrication using standard CMOS technology, IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, USA, 1988, pp. 148-150.
26. R.B. Johnson, R. Chung, M. Gaitan and D. Behring, SPIE Proc., Vol. 2269, 1994, pp. 338-347.
27. N.R. Swart and A. Nathan, An integrated CMOS polysilicon coil-based micro-Pirani gauge with high heat transfer efficiency, Tech. Digest, Int. Electron Devices Meet., San Francisco, CA, USA, 11-14 Dec., 1994, pp. 135-138.
28. M. Biebl, T. Scheiter, C. Hierold, H.v. Philipsborn and H. Klose, Micromechanics compatible with an 0.8 μm CMOS process, Sensors and Actuators A, 46-47 (1995) 593-597.
29. M. Hornung, R. Frey, O. Brand, H. Baltes and C. Hafner, Ultrasound barrier based on packaged micromachined membrane resonators, Proc. IEEE Micro Electro Mechanical Systems, MEMS, Amsterdam, Netherlands, 29 Jan.-2 Feb., 1995, pp. 334-339.
30. O. Brand, Micromachined acoustic resonators for proximity sensing, Ph.D. Thesis No. 10 896, ETH Zurich (1994).
31. S. Linder, H. Baltes, F. Gnaedinger and E. Doering, Photolithography in anisotropically etched grooves, Proc. IEEE Micro Electro Mechanical Systems, MEMS, San Diego, CA, USA, 11-15 Feb., 1996, pp. 38-43.
32. C.T.-C. Nguyen and R.T. Howe, CMOS micromechanical resonator oscillator, Tech. Digest, IEEE Int. Electron Devices Meet. IEDM, Washington, DC, USA, 5-8 Feb., 1993, pp. 199-202.
33. W. Kuehnel and S. Sherman, A surface micromachined silicon accelerometer with on-chip detection circuitry, Sensors and Actuators A, 45 (1994) 7-16.
34. J.H. Smith, S. Montague, J.J. Sniegowski, J.R. Murray and P.J. McWhorter, Embedded micromechanical devices for the monolithic integration of MEMS with CMOS, Tech. Digest, IEEE Int. Electron Devices Meet., Washington, DC, USA, 10-13 Dec., 1995, pp. 609-612.
35. M. von Arx, O. Paul and H. Baltes, Determination of the heat capacity of CMOS layers for optimal CMOS sensor design, Sensors and Actuators A, 46-47 (1995) 428-431.
36. O. Paul, M. von Arx and H. Baltes, Process-dependentthermophysical properties of CMOS IC thin films, Tech. Digest, 8th Int. Conf. Solid-State Sensors and Actuators/Eurosensors IX, Stockholm, Sweden, 25-29 June, 1995, Vol. 1, pp. 178-181.
37. M. von Arx, O. Paul and H. Baltes, Test structure to measure the Seebeck coefficient of CMOS IC polysilicon, Proc. Int. Conf. Microelectronic Test Structures ICMTS 1966, Trento, Italy, in press.
38. F. Mayer, O. Paul and H. Baltes, Influence of design geometry and packaging on the response of thermal gas flow sensors, Tech. Digest, 8th Int. Conf. Solid-State Sensors and Actuators/Eurosensors IX, Stockholm, Sweden, 25-29 June, 1995, Vol. 1, pp. 528-531.
39. F. Mayer, G. Salis, O. Paul and H. Baltes, Scaling of thermal CMOS gas flow microsensors: experiment and simulation, Proc. IEEE Micro Electro Mechanical Systems, MEMS, 11-15 Feb., 1996, pp. 116-121.
40. P. Malcovati, C. Azeredo Leme, R. Lenggenhager, F. Maloberti and H. Baltes, Low-noise multirate switched-capacitor read-out circuitry for thermoelectric integrated infrared sensors, IEEE Trans. Instrum. Meas., 44 (1995) 795-798.
41. D. Jaeggi, J. Funk, A. Häberli and H. Baltes, Overall system analysis of a CMOS thermal converter, Tech. Digest, 8th Int. Conf. Solid-State Sensors and Actuators/Eurosensors IX, Stockholm, Sweden, 25-29 June, 1995, Vol. 2, pp. 112-115.
42. P. Malcovati, A. Häberli, D. Jaeggi, F. Maloberti and H. Baltes, Oversampled A/D interface circuit for integrated AC power sensor, Tech. Digest, 8th Int. Conf. Solid-State Sensors and Actuators/Eurosensors IX, Stockholm, Sweden, 25-29 June, 1995, Vol. 1, pp. 119-122.
43. D. Jäggi, Thermal converters by CMOS techology, Ph.D. Thesis No. 11 567, ETH Zurich (1996).
44. O. Paul, O. Brand, R. Lenggenhager and H. Baltes, Vacuum gauging withIC microsensors, J. Vacuum Sci. Technol. A, 13 (1995) 503-508.
45. O. Paul and H. Baltes, Novel fully CMOS compatible vacuum sensor, Sensors and Actuators A, 46-47 (1995) 143-146.
46. A. Häberli, O. Paul, P. Malcovati, F. Maloberti and H. Baltes, CMOS integration of a thermal pressure sensor system, Proc. IEEE Int. Symp. Circuits and Systems, ISCAS, Atlanta, GA, USA, 12-15 May, 1996, Vol. 1, pp. 377-380.
47. J. Bühler, J. Funk, O. Paul, F.-P. Steiner and H. Baltes, Thermally actuated CMOS micro mirrors, Sensors and Actuators A, 46-47 (1995) 572-575.
48. U. Dibbern, Magnetoresistive sensors, in R. Boll and K.J. Overshott (eds.), Sensors 5: Magnetic Sensors, VCH, Weinheim, 1989, pp. 341-380.
49. S. Middelhoek, in J. Smit (ed.), Magnetic Properties of Materials, McGraw-Hill, New York, 1971, Ch. 8.
50. R. Popovic, J.-L. Berchier, G. Schneider, H. Lienhard, H. Baltes, K. Solt and T. Zajc, Magnetic field sensor, US Patent No. 4 607 271 (1986).
51. M. Allen, Polyimide-based process for the fabrication of thick electroplated microstructures, Tech. Digest, 7th Int. Conf. Solid-State Sensors and Actuators (Transducers '93), Yokohama, Japan, 7-10 June 1993, pp. 60-63.
52. M. Schneider, J.G. Korvink and H. Baltes, Magnetostatic modeling of an integrated microconcentrator, Tech. Digest, 8th Int. Conf. Solid-State Sensors and Actuators/Eurosensors IX, Stockholm, Sweden, 25-29 June, 1995, Vol. 2, pp. 9-12.
53. P. Malcovati, A. Häberli, F. Mayer, O. Paul, F. Maloberti and H. Baltes, Combined air humidity and flow CMOS microsensor with on-chip 15 bit sigma-delta A/D interface, Tech. Digest, Symp. VLSI Circuits, Kyoto, Japan, 8-10 June, 1995, pp. 45-46.
54. P. Malcovati, CMOS thermoelectric sensor interfaces, Ph.D. Thesis No. 11 424, ETH Zurich (1996).
55. M. Hornung, O. Brand and H. Baltes, Optimization of micromachined ultrasound transducer by finite element simulation, Tech. Digest, 8th Int. Conf. Solid-State Sensors and Actuators/Eurosensors IX, Stockholm, Sweden, 25-29 June, 1995, Vol. 2, pp. 620-623.
56. C. Kuratli, Q. Huang, O. Brand and H. Baltes, A self-calibrating barrier-detector microsystem in standard silicon cicuit technology, Proc. IEEE Symp. Industrial Electron., Athens, Greece, 10-14 July, 1995, pp. 867-871.
57. D. Bolliger, R.S. Popovic and H. Baltes, Integration of a smart selective UV detector, Tech. Digest, 8th Int. Conf. Solid-State Sensors and Actuators/Eurosensors IX, Stockholm, Sweden, 25-29 June, 1995, Vol. 2, pp. 144-147.
58. D. Bolliger, Integration of an ultraviolet selective photodetector, Ph.D. Thesis No. 11 359, ETH Zurich (1995).
59. D. Bolliger, P. Malcovati, A. Häberli, H. Baltes, P. Sarro and F. Maloberti, Integrated ultraviolet sensor system with on-chip 1 Gohm trans-impedance amplifier, Tech. Digest, IEEE Int. Solid-State Circuit Conf., ISSCC, San Fransisco, CA, USA, 8-10 Feb., 1996, pp. 328-329.
60. J.G. Korvink, J. Funk and H. Baltes, IMEMS modeling, Sensors Mater., 6 (1994) 235-243.
61. J. Funk, J. Bühler, J.G. Korvink and H. Baltes, Thermomechanical modelling of an actuated micromirror, Sensors and Actuators A, 46-47 (1995) 632-636.
62. J. Funk, Coupled modelling and simulation of IMEMS, Ph.D. Thesis, No. 11 378, ETH Zurich (1995).
63. J. Funk, J.G. Korvink, M. Bächtold and H. Baltes, Coupled 3D thermoelectro-mechanical simulations of microactuators, Proc. IEEE Micro Electro Mechanical Systems, MEMS, San Diego, CA, USA, 11-15 Feb., 1996, pp. 133-138.
64. J. Bühler, J. Funk, F.-P. Steiner, P.M. Sarro and H. Baltes, Double pass metallization for CMOS aluminium actuators, Tech. Digest, 8th Int. Conf. Solid-State Sensors and Actuators/Eurosensors IX, Stockholm, Sweden, 25-29 June, 1995, Vol. 2, pp. 360-363.
65. B.A. Kipfer (ed.), Bartlett's Book of Business Quotations, Little, Brown and Co., Boston, 1994.
66. G.K. Fedder, S. Santhanam, M.L. Reed, S.C. Eagle, D.F. Guillon, M.S.-C. Lu and L.R. Carley, Laminated high-aspect-ratio microstructures in a conventional CMOS process, Proc. IEEE Micro Electro Mechanical Systems, MEMS, San Diego, CA, USA, 11-15 Feb., 1996, pp. 13-18.
67. K.A. Shaw and N.C. MacDonald, Integrating SCREAM micromachined devices with integrated circuits, Proc. IEEE Micro Electro Mechanical Systems, MEMS, San Diego, CA, USA, 11-15 Feb., 1996, pp. 44-48.
68. G. Lin, K.S.J. Pister and K.P. Roos, Standard CMOS piezoresistive sensor to quantify heart cell contractile forces, Proc. IEEE Micro Electro Mechanical Systems, MEMS, San Diego, CA, USA, 11-15 Feb., 1996, pp. 150-155.
69. Y. Konaka and M.G. Allen, Single- and multi-layer electroplated microaccelerometers, Proc. IEEE Micro Electro Mechanical Systems, MEMS, San Diego, CA, USA, 11-15 Feb., 1996, pp. 168-173.
70. C. Hierold, A. Hildebrandt, U. Näher, T. Scheiter, B. Mesching, M. Steger and R. Tielert, A pure CMOS surface micromachined integrated accelerometer, Proc. IEEE Micro Electro Mechanical Sys15/16 tems, MEMS, San Diego, CA, USA, 11-15 Feb., 1996, pp. 174-179.
71. D. Mahdevan, Sensor packaging and assembly with a case study, Canadian Workshop on Micro Electro Mechanical Systems, University of Waterloo, Ontario, Canada, 19 Feb., 1996.
72. R. Frank, Understanding Smart Sensors, Artech House, Boston, 1996.
73. H. Sasaki, Multimedia complex on a chip, Tech, Digest, IEEE Int. Solid-State Circuit Conf., ISSCC, San Francisco, CA, USA, 8-10 Feb., 1996, pp. 16-19.
74. S. Middelhoek, Quo vadis silicon sensors?, Sensors and Actuators A, 41-42 (1994) 1-8.
75. D. Schaudel, Microsensors and actuators for industrial process application, Sensors Update, 1 (1996) in press.