Mechanical failure in COB-technology using glob-top encapsulation

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 19, Issue 4, 1996, Pages 232-240

  Dudek, Rainer ^a   Vogel, Dietmar ^a   Michel, Bernd ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; DELAMINATION; EPOXY RESINS; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); MATHEMATICAL MODELS; METALLOGRAPHY; MOISTURE; STRESS ANALYSIS; STRESS CONCENTRATION; THERMAL CYCLING; VISCOELASTICITY;

GLOB TOP FAILURE; PRONY SERIES; SCANNING ACOUSTIC MICROSCOPY (SAM);

ELECTRONICS PACKAGING;

EID: 0030257901     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.558549     Document Type: Article

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