Coffin-Manson fatigue model of underfilled flip-chips

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 3, 1997, Pages 317-325

  Gektin, Vadim ^a,d   Bar Cohen, Avram ^b,d   Ames, Jeremy ^c  

^a APPLIED MATERIALS INC   (United States)

^b University of Minnesota   (United States)

^c UNIVERSITY OF CALIFORNIA   (United States)

^d IEEE   (United States)

Author keywords

Coffin Manson; Fatigue; Flip chip; Solder; Thermal strain; Underfill

Indexed keywords

COMPUTER SIMULATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; SENSITIVITY ANALYSIS; SOLDERING; STRAIN RATE;

COFFIN MANSON FATIGUE MODEL; UNDERFILLED FLIP CHIPS;

ELECTRONICS PACKAGING;

EID: 0031234011     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.623026     Document Type: Article

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