Packaging of physical sensors for aggressive media applications

Journal of Micromechanics and Microengineering

Volumn 6, Issue 1, 1996, Pages 187-192

  Dyrbye, Karsten ^a   Brown, Tina Romedahl ^a   Eriksen, Gert Friis ^a  

^a Grundfos DK AS   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; ELECTRONIC EQUIPMENT MANUFACTURE; MICROELECTROMECHANICAL DEVICES; RELIABILITY; THIN FILMS;

MICROMECHANICAL SENSING ELEMENT;

SENSORS;

EID: 0030091517     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/6/1/038     Document Type: Article

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