Advanced packaging and substrate technology using conductive adhesives

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998

Volumn 1998-September, Issue , 1998, Pages 144-151

  Eda, Kazuo ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CHIP SCALE PACKAGES; COATINGS; JOINING; OSCILLATORS (ELECTRONIC);

ADVANCED PACKAGING; CONDUCTIVE ADHESIVE; HIGH DENSITY WIRING; KEY TECHNOLOGIES; SOLDER JOINTS; STUD BUMP BONDING; SUBSTRATE TECHNOLOGY; VIA HOLE;

SUBSTRATES;

EID: 0002911206     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.1998.742017     Document Type: Conference Paper

References (9)

1. Rao. R. Tummala, Eugene J. Rymaszewski, Microelectronics Packaging Handbook, Van Nostrand Reinhold, p289-310 (1989).
2. J. Liu, An Overview of Advances of Conductive Adhesive Joining Technology in Electronics Applications, Materials Technology, Vol. 10, Numbers 11/12, p. 247-252(1995).
3. J. Liu, Conductive Adhesives in Electronics Packaging, Electrical Publications, UK, (1997).
4. Y. Bessho, et al., A Stud Bump-Bonding Technique for High Density MCM, Proceedings of 1993 Japan IEMT Symposium, p. 362-365 (1993).
5. M. Okano, S. Nakamura, Y. Isozaki, K. Kawakita, H. Sogou, T. Kojima, T. Ogawa, Any Layer IVH Structure Multi Layered Printed Wiring Board, Microelectronics Symposium, pl63-166 (1995).
6. Y. Bessho et al., Stud Bump Bonding Technique for Advanced MCM-Ls, Proceedings of 11 th EMC, p. 167-174 ( 1997).
7. K. Amami et al., MCM-ALIVH Using SBB Flip-Chip Bonding Technique, Proceedings of ISHM'97, p. 278-283 ( 1997).
8. T. Shiraishi et al., Flip Chip MPU Module on High Performance Printed Circuit Board "ALIVH", Proceedings of MCM'98, p. 520-525 ( 1998).
9. M. Itagaki et al., Packaging Properties of ALIVH-CSP using SBB Flip-Chop Bonding Technology, Proceedings of MCM'98, p. 236-241 ( 1998).