Thermo-structural behavior of underfilled flip-chips

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 440-447

  Gektin, Vadim ^a   Bar Cohen, Avram ^a   Witzman, Sorin ^a  

^a UNIVERSITY OF MINNESOTA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPUTER SIMULATION; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT MANUFACTURE; RELIABILITY; SENSITIVITY ANALYSIS; SHEAR STRESS; SOLDERED JOINTS; STRAIN; THERMODYNAMIC PROPERTIES;

COEFFICIENT OF THERMAL EXPANSION; COFFIN-MANSON RELATION; FLIP CHIP TECHNOLOGY; SILICON DUE; SINGLE CHIP PACKAGES; SOLDER BUMP HEIGHTS; THERMAL STRAIN; THERMOSTRUCTURAL PROPERTIES; UNDERFILL MATERIALS;

FLIP CHIP DEVICES;

EID: 0029718117     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (12)