Polymeric conductive pastes as solder replacement for flip-chip attachment

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 21, Issue 4, 1998, Pages 382-393

  Maner, Kaoru U ^b   Ang, Simon S ^a,b   Schaper, Leonard W ^b   Brown, William D ^a,b  

^a IEEE

^b UNIVERSITY OF ARKANSAS   (United States)

Author keywords

Flip chip; Polymeric conductive pastes; Thermoplastic; Thermoset

Indexed keywords

CONDUCTIVE MATERIALS; ELECTRIC CONTACTS; FLIP CHIP DEVICES; THERMOPLASTICS; THERMOSETS;

POLYMERIC CONDUCTIVE PASTES;

ELECTRONICS PACKAGING;

EID: 0032205302     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.730422     Document Type: Article

References (9)

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8. F. W. Kulesza and R. H. Estes, "Polymer flip chip PFC: A technology assessment of solder less bump processes and reliability," Product literature, Epoxy Technology, Inc., 14 Fortune Drive, Billerica, MA 01821.
9. D. Francis, "Flip chip technology: The interconnect method for the 90's," in Proc. 1992 Int. Electron. Packag. Conf., Austin, TX, Sept. 27-30, 1992.