Solder self-assembly for MEMS

Instrumentation in the Aerospace Industry : Proceedings of the International Symposium

Volumn 44, Issue , 1998, Pages 249-255

  Harsh, Kevin F ^a   Irwin, Ronda S ^a   Lee, Y C ^a  

^a UNIVERSITY OF COLORADO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; ELECTRONICS PACKAGING; SOLDERING; SURFACE TENSION;

SOLDER SELF ASSEMBLY;

MICROELECTROMECHANICAL DEVICES;

EID: 0031702213     PISSN: 02277576     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)