Highly flexible design and production framework for modularized microelectromechanical systems

Sensors and Actuators, A: Physical

Volumn 73, Issue 1-2, 1999, Pages 153-168

  Schuenemann, M ^a   Grosser, V ^b   Leutenbauer, R ^b   Bauer, G ^a   Schaefer, W ^a   Reichl, H ^b  

^a FRAUNHOFER INSTITUTE FOR MANUFACTURING ENGINEERING AND AUTOMATION IPA   (Germany)

^b Fraunhofer Inst Mech R   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; PRODUCT DESIGN; PRODUCTION ENGINEERING; STANDARDIZATION;

TOP-BOTTOM BALL GRID ARRAYS (TB-BGA);

MICROELECTROMECHANICAL DEVICES;

EID: 0033537518     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(98)00266-0     Document Type: Article

References (19)

1. J. Bryzek, Starting MEMS manufacturing business in Silicon Valley, in: S. Walsh (Ed.), Commercialization of Microsystems '96, Conference Proceedings, Semiconductor Equipment and Materials International, Mountain View, CA, USA (1996), pp. 251-263.
2. M. Schuenemann, V. Grosser, R. Leutenbauer, P. Matuscheck, W. Schaefer, H. Reichl, Modularized microelectromechanical devices as key components for advanced intelligent autonomous sensors and control systems, in: B.O. Nnaji, A. Wang (Eds.), Sensors and Controls for Advanced Manufacturing, Proceedings of SPIE, Vol. 3201, SPIE, Bellingham, WA, USA (1997), pp. 108-123.
3. Baltes H. The future of IC microtransducers. Sensors and Actuators A. 56:1996;179-192.
4. Fujita H. Future of actuators and microsystems. Sensors and Actuators A. 56:1996;105-111.
5. R. Mehaso, Notes on the future of commercialization of microsystems, in: S. Walsh (Ed.), Commercialization of Microsystems '96, Conference Proceedings, Semiconductor Equipment and Materials International, Mountain View, CA, USA (1996), pp. vi-viii.
6. Fluitman J. Microsystems technology: objectives. Sensors and Actuators A. 56:1996;151-166.
7. Schomburg W.K., Maas D., Bacher W., Buestgens B., Fahrenberg J., Menz W., Seidel D. Assembly for micromechanics and LIGA. Journal of Micromechanics and Microengineering. 5:1995;57-63.
8. Al-Sarawi S.F., Abbott D., Franzon P.D. A review of 3-D packaging technology. IEEE Trans., Components, Hybrids, Manuf. Technol., Part B, CPMT-B. 21:1998;2-14.
9. S. Bouwstra, Stacked multi-chip-module technology for high performance intelligent transducers, in: K. Chau, R.M. Roop (Eds.), Micromachined Devices and Components II, SPIE Proceedings, Vol. 2882, SPIE, Bellingham, WA, USA (1996), pp. 49-52.
10. R. Leutenbauer, V. Grosser, B. Michel, H. Reichl, The development of a top-bottom-BGA (TB-BGA), in: R.W. Johnson (Ed.), Proceedings of the International Conference and Exhibition on Multichip Modules and High Density Packaging, International Microelectronics and Packaging Society, Denver, CO, USA (1998).
11. J.H. Lau, A brief introduction to flip chip technologies for multichip module applications, in: J.H. Lau (Ed.), Flip Chip Technologies, McGraw-Hill, New York, NY, USA (1995), pp. 1-82.
12. J.H. Lau, Y.-H. Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York, NY, USA (1997).
13. J. Simon, G. Chmiel, R. Leutenbauer, H. Reichl, The development of a FC-BGA, in: Proc. ITAB '95, International Flip Chip, Ball Grid Array, TAB and Advanced Packaging Symposium, San Jose, CA, USA (1995).
14. C.E. Bauer, Three dimensional packaging for high performance electronics, in: Proceedings 1993 International Conference on Multichip Modules, SPIE, Vol. 2105, Dallas, TX, USA, ISHM Microelectron. Soc. (1993), pp. 159-163.
15. DuPont Electronics (Ed.), LTCC-Technology Design and Layout Guideline Green Tape™ System, Frenchay (GB), DuPont Electronics, Microcircuit Materials Division (1996).
16. A.L. Eustice, S.J. Horowitz, J.J. Stewart, A.R. Travis, H.T. Sawhill, Low temperature co-fireable ceramics: a new approach for electronic packaging, in: R.W. Johnson, R.K.F. Teng, J.W. Balde (Eds.), Multichip Modules, System Advantages, Major Constructions, and Materials Technology, IEEE Press, Piscataway, NJ, USA (1991), pp. 435-445.
17. Y. Shimada, Y. Yamashita, H. Takamizawa, Low Dielectric Constant Multilayer Glass-Ceramic Substrate with Ag-Pd Wiring for VLSI Package, IEEE Trans. Components, Hybrids, Manuf. Technol., CPMT-11 (1988), pp. 163-170.
18. F. Ansorge, K.-F. Becker, R. Ehrlich, G. Azdasht, V. Bader, R. Aschenbrenner, H. Reichl, Recent progress in flexible molding and reliability investigations of CSP and BGA packages using advanced interconnection technology, in: Proc. PEP, Norrkoeping (SE) (1997).
19. R. Fillion, R. Wojnarowski, B. Gorowitz, W. Daum, H. Cole, Conformal multichip-on-flex (MCM-F) technology, in: Proceedings 1995 International Conference on Multichip Modules, SPIE, Vol. 2575, ISHM Microelectron. Soc., Reston, VA, USA (1995), pp. 572 ff.