Efficient approach to predict solder fatigue life and its application to SM- and area array components

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 462-471

  Dudek, Rainer ^a   Nylen, Margareta ^a   Schubert, Andreas ^a   Michel, Bernd ^a   Reichl, Herbert ^a  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; COMPUTATIONAL METHODS; CRACK INITIATION; CRACK PROPAGATION; CREEP; DEGRADATION; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; STRAIN; THERMAL CYCLING;

PLASTIC BALL GRID ARRAYS (PBGA);

SOLDERED JOINTS;

EID: 0030678362     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)