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Volumn 1, Issue 3, 1998, Pages 225-233
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Viscoelastic study of a conductive adhesive for electronic packages. Part 2: Thermal stress analysis using the finite element method
a
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVES;
COMPUTER SOFTWARE;
CREEP;
FINITE ELEMENT METHOD;
MATHEMATICAL MODELS;
RELAXATION PROCESSES;
STRAIN;
STRESS ANALYSIS;
THERMAL CYCLING;
THERMAL LOAD;
THERMAL STRESS;
VISCOELASTICITY;
CONDUCTIVE ADHESIVES;
PRONY SERIES EXPANSION;
RELAXATION MODULUS;
ELECTRONICS PACKAGING;
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EID: 0032294432
PISSN: 10236228
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (4)
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References (12)
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