Parametric dependence of fatigue of electronic adhesives

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998

Volumn 1998-September, Issue , 1998, Pages 116-124

  Gladkov, Alex ^a   Bar Cohen, Avram ^a  

^a University of Minnesota   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COATINGS; JOINING; MANUFACTURE; SHEAR STRESS; SOLDERED JOINTS; THERMAL EXPANSION;

BONDED MATERIALS; CYCLIC FREQUENCY; CYCLIC SHEAR STRESS; DIFFERENTIAL THERMAL EXPANSION; ELECTRONIC APPLICATION; EPOXY ADHESIVES; LAP-SHEAR SPECIMEN; PARAMETRIC DEPENDENCE;

FATIGUE OF MATERIALS;

EID: 84903385473     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.1998.742013     Document Type: Conference Paper

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