Low-cost plastic sensor packaging using the open-window package concept

Sensors and Actuators, A: Physical

Volumn 67, Issue 1-3, 1998, Pages 185-190

  Cotofana, C ^a   Bossche, A ^a   Kaldenberg, P ^b   Mollinger, J ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b Eurasem BV   (Netherlands)

Author keywords

Open window package; Plastic packaging; Sensor packaging

Indexed keywords

SENSORS;

OPEN WINDOW PACKAGE; PLASTIC PACKAGING; SENSOR PACKAGING;

ELECTRONICS PACKAGING;

EID: 0042284296     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(97)01767-6     Document Type: Article

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