Isotropically conductive adhesives and solder bumps for flip chip on board circuits-a comparison of lifetime under thermal cycling

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998

Volumn 1998-September, Issue , 1998, Pages 125-131

  Nysaether, Jon B ^a,b   Lai, Zonghe ^c   Liu, Johan ^c  

^a UNIVERSITY OF OSLO   (Norway)

^b SINTEF   (Norway)

^c IVF   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COATINGS; JOINING; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; THERMAL CYCLING; THERMAL EXPANSION; TIMING CIRCUITS;

ANALYTICAL CALCULATION; FLIP CHIP ON BOARDS; ISOTROPICALLY CONDUCTIVE ADHESIVES; LIFETIME MEASUREMENTS; MATERIAL SYSTEMS; MODEL PREDICTION; STRAIN CALCULATIONS; UNDERFILL MATERIALS;

FLIP CHIP DEVICES;

EID: 0343440689     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.1998.742014     Document Type: Conference Paper

References (22)

1. Kauzo Eda, Matsushita Electric, Japan, Private Communication, June, 1997.
2. Liu, J, "Recent Advances in Conductive Adhesives for Direct Chip Attach Applications", The First IEEE International Symposium on Polymeric Electronics Packaging, Norrkoping, Sweden, 1997
3. Flip-Chip bonding using isotropically conductive adhesives, Bela Rosner, Johan Liu and Zonghe Lai, Proceedings of the 46th Electronic Components and Technology Conference (ECTC), May 28-31, 1996, Florida, USA, pp578-581.
4. Estes, R, Kulesza, F, "Reliability of Smart Card/IC Modules Assembled Using Polymer Flip Chip Packaging", Second International Conference on Adhesive Joining Technology in Electronis Manufacturing, Stockholm, 1996
5. Nystether, J, Lundström, P, Liu, J, "Piezoresistive Measurement Of Mechanical Stress In Epoxy Underfilled Flip-Chip-On-Board Devices', EEP-Vol 19-2, Advances in Electronic Packaging, ASME (1997)
6. Rzepka, S., Waidhaus, B., Meusel, E., 'Adhesive stabilised and pure flip chips on various substrates tinder thermocycling" Microsystem Technologies 1, pp 129-136, 1995
7. Norris, K, "Reliahility of Controlled collapse Interconnections", IBM J. Research Devel., May 1969, p 266
8. Bressers, H., Pens, P., Caers, J., Wondergcm, J.: 'Influence of Chemistry and Processing of Flip Chip underfills on Reliability', 2nd Inlernational Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Stockho1n Sweden, 1996
9. Nysæther, J, Lundstrom, P, Liu, I, "Measurements of function of underfill First IEEE International Symposium s Packaging, Norrkiiping, Sweden, bump lifetime as a material properties", The on Polymeric Electioni 1997
10. Solomon, H, Transactions on Compc I echnology, Vol CHMT-'Fatigue of 60/40 solder", IEEE nents, Hybrids and Manufacturing pp 423-432, December 1986
11. Engelmaier, W. "Surface Mount attachment reliability of Chip-Leadid Ceramic Chip Carriers on FR-4 Circuit Boards", IEEE Trans on Components, Hybrids and Manufacturing Technology, Vol 12, No 2, June 1989
12. Gektin, V, Bar-Cohen, A, Witzman, S, 'CoffinManson based fatigue Analysis of underfilled DCA", EEP-Vol 19-2, Advances in Electr nic Packaging, ASME (1997)
13. Schubert, A, D Michel, B, Reichl, H, "Thermomcchamcal Reliability Analysis by Combined Microdac and the fitnite EEP-Vol 19-2, Advances in Electronic Packaging, ASME (1997)
14. Yeh, C, Wu, Wyatt, K, Zhou, W, "Reliability attach (DCA) using Parametric Finite Element Analysis", 2nd International Symposium on Electronic Packaging Tecpnology, Shanghai, China, 1996.
15. Lau, J., "Thermal Fatigue Life Prediction of Encapsulated Flip Chip Solder Joints for Surface Laminar Circuit Packaging" ASME Winter Annual meeting, 92-WA/EEP-34, pp 2-9, 1992
16. Suhir, E., "Die attachment and Its Influence on Thermal stresses in the die and the Attachment", Proc 37th Electronics Component Conference, IEEE/EIA, pp 143-148, 1987
17. Aschenbrenner, R, Miessner, R, Reichl, H, "Adhesive Flip Chip Bonding on Flexible Substrates", The First IEEE International Symposium on Polymeric Electronics Packaging, Norrkoping, Sweden, 1997
18. Botter, H, van der Plas, R B, Junai, A Arun, "Factors that Influence the Electrical Contact Resistance of Isotropic Conductive Adhesive Joints during Climate Chamber Testing", Second International Conference on Adhesive Joining Technology in Electronics Manufacturing, Stockholm, 1996
19. Wong, CP., Lu, Daoqiang, Meyers, L, Vona, S A, Tong, Q K, "Fundamental Study of Electrically Conductive Adhesives (ECAs)", The First IEEE International Symposium on Polymeric Electronics Packaging, Norrkoping, Sweden, 1997
20. Bjorneklett, A, Tuhus, T, Halbo, L, Rristiansen, H, Thermal Resistance, Thermomechanical Stress and Thermal Cycling Endurance of Silicon Chips Bonded with Adhesives, Proceedings of the IEEE Semiconductor Thermal Measurement and Management Symposium-93, Austin Texas
21. Moet, A and Aglan, H, "Fatigue Failure", in Engineered Materials Handbook, Vol 2 "Engineering Plastics", ASM International 1988
22. Rosner, B, "The Beneficial Effect of Underfilling on the Reliability of Flip Chip Joints", The First IEEE International Symposium on Polymeric Electronics Packaging, Norrkoping, Sweden, 1997