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Volumn 66, Issue 1-3, 1998, Pages 279-283

Photolithographic packaging of silicon pressure sensors

Author keywords

FEM simulation; Packaging; Photolithography; Pressure sensors; Silicone

Indexed keywords

COMPUTER SIMULATION; ELASTIC MODULI; ELECTRONICS PACKAGING; ENCAPSULATION; FINITE ELEMENT METHOD; MICROELECTRONICS; PHOTOLITHOGRAPHY; PIEZOELECTRIC DEVICES; SILICON SENSORS; SILICONES;

EID: 0032047246     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(97)01710-X     Document Type: Article
Times cited : (15)

References (7)
  • 3
    • 0040918097 scopus 로고
    • Pressure sensor device data, Motorola Inc.
    • Pressure sensor device data, Motorola Inc., 1994.
    • (1994)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.