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Volumn 66, Issue 1-3, 1998, Pages 279-283
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Photolithographic packaging of silicon pressure sensors
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Author keywords
FEM simulation; Packaging; Photolithography; Pressure sensors; Silicone
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Indexed keywords
COMPUTER SIMULATION;
ELASTIC MODULI;
ELECTRONICS PACKAGING;
ENCAPSULATION;
FINITE ELEMENT METHOD;
MICROELECTRONICS;
PHOTOLITHOGRAPHY;
PIEZOELECTRIC DEVICES;
SILICON SENSORS;
SILICONES;
SOFT MOUNTING TECHNIQUES;
PRESSURE TRANSDUCERS;
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EID: 0032047246
PISSN: 09244247
EISSN: None
Source Type: Journal
DOI: 10.1016/S0924-4247(97)01710-X Document Type: Article |
Times cited : (15)
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References (7)
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