Parametric finite element analysis of flip chip reliability

International Journal of Microcircuits and Electronic Packaging

Volumn 19, Issue 2, 1996, Pages 120-127

  Yeh, Chao pin ^a   Zhou, Wen X ^a   Wyatt, Karl ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN; FAILURE ANALYSIS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; PLASTIC FILMS; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; THERMAL EXPANSION;

DIE SIZE; DIE THICKNESS; FAILURE MODES; FLIP CHIP ON BOARD TECHNOLOGY; FLIP CHIP RELIABILITY; PARAMETRIC FINITE ELEMENT ANALYSIS; PRINTED WIRING BOARD THICKNESS; SOLDER JOINT FATIGUE LIFE; THERMAL CYCLIC LOADINGS; UNDERFILL THICKNESS;

ELECTRONICS PACKAGING;

EID: 0030172955     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)